1995
DOI: 10.1007/bf00294146
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Poly(thioether imide)s via chloro-displacement polymerization

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Cited by 8 publications
(3 citation statements)
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“…FPIs (FPI-1 to FPI-8) were synthesized by nucleophilic substitution reaction. 19 25 The typical procedure adopted for the synthesis of FPI-1 was as follows. Into a 100-mL round-bottomed flask fitted with a Dean–Stark trap, diol monomer IVa (0.01 mol), 30 mL of dry NMP, 20 mL of toluene and anhydrous potassium carbonate (0.022 mol) were added.…”
Section: Methodsmentioning
confidence: 99%
“…FPIs (FPI-1 to FPI-8) were synthesized by nucleophilic substitution reaction. 19 25 The typical procedure adopted for the synthesis of FPI-1 was as follows. Into a 100-mL round-bottomed flask fitted with a Dean–Stark trap, diol monomer IVa (0.01 mol), 30 mL of dry NMP, 20 mL of toluene and anhydrous potassium carbonate (0.022 mol) were added.…”
Section: Methodsmentioning
confidence: 99%
“…Thiruvasagam recently synthesized polyetherimides by aromatic nucleophilic substitution reactions from AB-type monomers containing both phenolate salt and nitrophthalimide [42,43]. As early as in 1995, Mathias LJ attempted to synthesize poly(thioether imide)s from N-(p-mercaptophenyl)-4-chlorophthalimide (AB monomer); nevertheless, this kind of polyimide was only soluble in sulfuric acid and flexible films could not be obtained because of low molecular weight and limited flexibility of polymer backbone itself [44]. As far as we know, most researchers are focused on the work of polyetherimides from selfcondensation of AB-type monomers; only very few are concerned about polythioetherimides.…”
Section: Introductionmentioning
confidence: 99%
“…In the literature, to our knowledge, some pioneering works have been performed on PTEIs, such as the PTEIs based on 3,3',4,4'-thiodiphenyltetracarboxylic dianhydride [8], those based on diamine-terminated oligo(phenylene thioether)s [9], and those derived from chloro-displacement polymerization of substituted phthalimides and thiolates [10]. The applications include high temperature adhesives for bonding steels [11], high temperature composites [12] and gas separation membranes [13].…”
Section: Introductionmentioning
confidence: 99%