In this report, we present a new class of injectable oleogels and a composite gel derived from glycolipids that provide a reversible interlinked 3D fiberous network architecture for effective wound closure by tissue regrowth and regeneration.
Globally, wound infections are considered as one of the major healthcare problems owing to the delayed healing process in diabetic patients and microbial contamination. Thus, the development of advanced materials for wound skin repair is of great research interest. Even though several biomaterials were identified as wound healing agents, gel-based scaffolds derived from either polymer or small molecules have displayed promising wound closure mechanism. Herein, for the first time, we report an injectable and self-healing self-assembled anesthetic oleogel derived from glycolipid, which exhibits antibiofilm and wound closure performance in diabetic rat. Glycolipid derived by the reaction of hydrophobic vinyl ester with α-chloralose in the presence of novozyme 435 undergoes spontaneous self-assembly in paraffin oil furnished an oleogel displaying self-healing behavior. In addition, we have prepared composite gel by encapsulating curcumin in the 3D fibrous network of oleogel. More interestingly, glycolipid in its native form demoed potential in disassembling methicillin-resistant Staphylococcus aureus, methicillin-susceptible Staphylococcus aureus, and Pseudomonas aeruginosa biofilms. Both oleogel and composite gel enhanced the wound skin repair in diabetic induced Wistar rats by promoting collagen synthesis, controlling free radical generation and further regulating tissue remodeling phases. Altogether, the reported supramolecular self-assembled anesthetic glycolipid could be potentially used for diabetic skin wound repair and to treat bacterial biofilm related infections.
Four diimide–diol monomers were synthesized from 4,4′-(hexafluoroisopropylidene)diphthalic dianhydride and aminophenol/aminonaphthol. The structures of the monomers were characterized by spectroscopic analysis. A series of fluorinated polyimides (FPI-1 to FPI-8) were synthesized from these new diols and 4,4′-difluorobenzophenone/4,4′-dichlorodiphenyl sulphone, through nucleophilic displacement reaction. The FPIs were characterized by Fourier transform infrared spectroscopy, proton nuclear magnetic resonance, X-ray diffraction, thermogravimetry, differential scanning calorimetry, solution viscosity, solubility test, and dielectric properties test. FPIs were amorphous and showed good solubility due to the presence of >C(CF3)2 unit and flexible groups in the polyimides backbone. These FPIs also showed good thermal stability and the 10% weight loss occurred in the range 353–505°C. The limiting oxygen index values of FPIs were in the range of 31.5–39.1 and such FPIs can be used as self-extinguishing polymers. These FPIs have a dielectric constant in the range of 3.10–4.23 and can be used as high temperature electrical insulation materials.
Four new aromatic diimide-diol monomers were synthesized from bisphenol A dianhydride and hydroxyamines. The poly(ether-imide)s (PEI-1 to PEI-4) were synthesized from these diols and 4,4 0 -difluorobenzophenone-IV via carbonylactivated aromatic nucleophilic fluoro displacement reaction. The chemical structures of the monomers and PEIs were confirmed by Fourier transform infrared spectrometer and proton nuclear magnetic resonance spectroscopies. The PEIs synthesized here were amorphous and soluble in polar aprotic solvents and low-boiling organic solvents. The PEIs had good thermal stability, 10% weight loss occurred in the temperatures range of 400-448 C, and char yields at 800 C under nitrogen atmosphere was in the range of 14-22%. The limiting oxygen index values of PEIs were in the range of 23.1-26.3, and such PEIs can be used as self-extinguishing polymers. The dielectric constants of the PEIs were in the range of 3.30-4.00, and such PEIs can be used as electrical insulation materials for systems operating at high temperature for long time.
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