A series of new bismaleimides containing silicone linkages have
been prepared via Diels–Alder reaction of bismaleimides
containing silicone and bisfurans containing silicone; their
molecular structures have been characterized by FTIR, NMR and
elemental analysis. The solubility of the prepared bismaleimides was
tested in six types of solvent of different boiling point and
polarity, and their curing temperatures were determined by DSC. The
thermal‐oxidative stability of the cured networks was
investigated by TGA and their glass transition temperatures were
measured by DSC, revealing that the bismaleimides are soluble in low
boiling point solvents and their curing temperatures are in the range
206–285°C. The DSC and TGA traces of cured networks show
that the glass transition temperatures are in the range
287–331°C and that these resins are stable up to
353–384°C.
© 1999 Society of Chemical Industry