Preparation, solubility and thermal behaviour of new bismaleimides containing silicone linkages

Abstract

A series of new bismaleimides containing silicone linkages have been prepared via Diels–Alder reaction of bismaleimides containing silicone and bisfurans containing silicone; their molecular structures have been characterized by FTIR, NMR and elemental analysis. The solubility of the prepared bismaleimides was tested in six types of solvent of different boiling point and polarity, and their curing temperatures were determined by DSC. The thermal‐oxidative stability of the cured networks was investigated by TGA and their glass transition temperatures were measured by DSC, revealing that the bismaleimides are soluble in low boiling point solvents and their curing temperatures are in the range 206–285°C. The DSC and TGA traces of cured networks show that the glass transition temperatures are in the range 287–331°C and that these resins are stable up to 353–384°C. © 1999 Society of Chemical Industry

Melt-Blown Cross-Linked Fibers from Thermally Reversible Diels–Alder Polymer Networks

“…Thermogram 3 was obtained on a cured FMA-BMA/M2 network after annealing at 162 °C for 15 min, followed by quenching to RT at 20 °C/min and maintaining at RT for 120 h. This sample (thermogram 3 in Figure B) exhibited the same T g as the originally fully cured FMA-BMA/M2 bulk network shown as thermogram 1 , confirming the robust thermoreversibility of the furan–maleimide network. Such excellent reversibility can be attributed to the selection of furan and maleimide which allows the retro-Diels–Alder reaction to occur without significant side reactions. ,− Thermograms 4 and 5 in Figure B show the FMA-BMA and M2 pure components, respectively, confirming that they are thermally stable over the temperature range of interest.…”