Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Lu, Yao; He, Xiangning; En, Yunfei; Wang, Xin; Zhang, Zhiqiang

doi:10.1016/j.actamat.2009.02.015

Cited by 60 publications

(11 citation statements)

References 16 publications

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“…Cu is extensively used as the contact metallization in conventional electronics assemblies particularly on printed circuit boards (PCBs) and increasingly as the interconnection layer on semiconductor devices in electronics industry, while Sn-based alloys are universally used as interconnection materials [27][28][29]. The resulting Cu-Sn intermetallic compounds formed during soldering process show an important role in the wettability of solders [30].…”

Section: Introductionmentioning

confidence: 99%

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

Zhang

Xue

Zeng

et al. 2012

Journal of Alloys and Compounds

109

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Section: Introductionmentioning

confidence: 99%

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

Zhang

Xue

Zeng

et al. 2012

Journal of Alloys and Compounds

109

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“…Generally, the thickness of an IMC layer in a diffusion couple can be expressed by a simple parabolic equation [11,12,27,47,48], as given below:…”

Section: Diffusion Coefficient In Solder Joints Under Exposure To Difmentioning

confidence: 99%

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Othman¹,

Binh²,

Ismail³

et al. 2012

Intermetallics

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“…As a result, the newly 3D IC technology is expected to confront electrical reliability problems associated with electromigration, thermomigration. Electromigration is the enhanced diffusion of atoms in the current direction [8]. The concentrated joule heating near the electron-entering positions from interconnect to micro-bump due to excessively high local current density during the accelerated electromigration test can be significant [9].…”

Section: Introductionmentioning

confidence: 99%

Structure effects on the electrical reliability of fine-pitch Cu micro-bumps for 3D integration

Lee

Kim

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Recently, flip chip solder bumps have been replaced by the fine-pitch solder micro-bump due to the miniaturization of electronic devices and the high performance requirement, and so on. Because of the fast decreasing size of the micro-bump and increasing power consumption needs in logic through-Si via applications, the significance of electromigration among major reliability issues have been increased. There are several important electrical current-induced reliability issues such as current crowding, polarity effect and thermomigration. And the excessive intermetallic compound (IMC) growth and Kirkendall voiding or micro voiding in micro-bump can degrade the mechanical reliability as well as electrical reliability. Therefore, the understanding of fundamental IMC growth mechanism is essential. This study systematically investigated the effects of bump structures such as solder height and UBM structure on the IMC growth kinetics and electromigration performance of Cu micro-bump. Quantitative analyses on the IMC growth kinetics during in-situ electromigration test were performed in a scanning electron microscope chamber under current stressing conditions with current density of 1.5 x 10 5 A/cm 2 at 150℃. Under high temperature and electric current stressing, the IMCs growth is accelerated by electron wind force. And the IMC phase transition time became shorter because IMC growth rates increased. In Cu/Sn-Ag and Cu/Ni/Sn-Ag system, the effect of current crowding and Joule heating was negligible in fully IMC-transformed micro-bump. Finally, microvoid formation mechanisms during IMC growth in the Cu/Ni/thin Sn system were discussed in detail.

show abstract

Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Cited by 60 publications

References 16 publications

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Structure effects on the electrical reliability of fine-pitch Cu micro-bumps for 3D integration

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