Intermetallics
 2012
DOI: 10.1016/j.intermet.2011.10.011
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Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Rosli Othman1,
Do Nam Binh2,
Anas Ismail3
et al.
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Cited by 13 publications
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