Platinum redistribution in the Ni0.9Pt0.1/InP system: Impact on solid-state reaction and layer morphology

Development of Ni₂P Contact Technology and Its Integration on III-V Materials for 300 mm Si Photonics Platform

“…From an electrical standpoint, Ni 0.9 Pt 0.1 led to the highest contact resistivity, even though it remained compatible with the requirements of the integration [23]. The formation of Pt-based compounds such as Pt 3 In 7 [21] was probably not favorable for the contact resistivity. The contact resistivity reached in the case of Ni and Ni 2 P were overall the same on the [250 -350 °C] temperature range (2 -3 × 10 −5 Ω.cm 2 ).…”

“…For all the systems, an initial metal thickness of 20 nm capped by a TiN layer was deposited on the n-InP layers. Out of the three Ni-based investigated contacts, it should be reminded that both Ni and Ni 0.9 Pt 0.1 led to an evolution of the phase formation sequence over the investigated temperature range [21], [33], while Ni 2 P remained the sole crystallized phase up to 500 °C included. From an electrical standpoint, Ni 0.9 Pt 0.1 led to the highest contact resistivity, even though it remained compatible with the requirements of the integration [23].…”

“…Fig. 6 also shows a comparison between the electrical properties of the Ni 2 P/n-InP system and two other Ni-based contact metallizations previously investigated, namely Ni (square symbols) and Ni 0.9 Pt 0.1 (triangle symbols) [21], [33]. For all the systems, an initial metal thickness of 20 nm capped by a TiN layer was deposited on the n-InP layers.…”

“…In our group, at the CEA-Leti, we developed a contact technology that is fully compatible with a Si-Fab line. This implies studies ranging from surface preparation [16], [17] and solid-state reaction [18]- [21] to electrical results [22], [23] and integration schemes [24]- [26]. A strong experience was obtained in 200 mm with the development of a CMOS-compatible contact technology [26].…”

Quasi‐synchronous solid‐state reaction for cordierite powder synthesis

“…Mixing will result in the addition of α-cordierite particles that impede the migration of Al 2 O 3 or enstatite particles and prevent them from contacting and reacting with the corresponding particles. 31,32 The α-cordierite particles mixed into the starting composition will share Al 2 O 3 particles with kaolinite and talc and remove certain amounts of Al 2 O 3 particles apart from the surface of the two particles, reducing the number of Al 2 O 3 particles attached to kaolinite and talc. This should quantitatively reduce the reaction contact points of Al 2 O 3 with enstatite particles with respect to the surface areas of the mixed α-cordierite powders.…”