Platinum Plating from Alkaline Solutions

Davies, Earl C. H.; Powell, A. R.

doi:10.1080/00202967.1937.11869339

Cited by 2 publications

(3 citation statements)

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“…Prior to 1995, all platinum plating baths used in aluminide coating production [1,2,7&101 contained high concentrations of potentially harmful elements (S and/or P and/or Cl). During 1995, a hydroxide platinum plating bath [11] entered commercial platinum aluminide coating production, and the raw materials used in its' formulation contain low concentrations of S, P and Cl. However, the hydroxide bath [11] does have a high concentration of potassium.…”

Section: Presented At the International Gas Turbine And Aeroengine Congmentioning

confidence: 99%

“…During 1995, a hydroxide platinum plating bath [11] entered commercial platinum aluminide coating production, and the raw materials used in its' formulation contain low concentrations of S, P and Cl. However, the hydroxide bath [11] does have a high concentration of potassium. Chemical analysis [21] of the as plated and the as coated foils from these baths allowed examination of contaminants introduced by the various plating processes, and cyclic oxidation testing of the tabs processed along with the foils permitted evaluation of the influence these impurities have upon a coatings resistance to environmental attack.…”

Section: Presented At the International Gas Turbine And Aeroengine Congmentioning

confidence: 99%

“…Since the introduction [7] of platinum modified diffusion coatings, the majority of commercial production involved either a P salt [10] or a Q salt [7]. In 1995, a derivative of a potassium hydroxide based platinum plating bath [11] entered Pt aluminide coating production. The following discussion includes information obtained from the foil and test tab work conducted on a production Q salt [7] and the production hydroxide bath [18].…”

Section: Electroplating Studymentioning

confidence: 99%

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Improved Pt Aluminide Coatings Using CVD and Novel Platinum Electroplating

Warnes

1998

Volume 5: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation;

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Chemical vapor deposition (CVD) is an old coating technology, but it was not successfully utilized to aluminize gas turbine hardware until recently (1989). In CVD aluminizing, the use of multiple, independently controlled, low temperature, external, metal halide generators combined with computer control of all process variables gives flexibility and consistent quality that is not possible with any other aluminizing process. It has been shown that harmful coating impurities (such as sulfur and boron etc.) can be transported to a coating from a high temperature aluminum source in the coating chamber during aluminizing. Representative processes include: pack cementation, above the pack, SNECMA, and high activity CVD. In contrast, it has also been demonstrated that CVD low activity aluminizing removes harmful impurities (S, P, B & W etc.) from the coating during deposition. Furthermore, clean, low activity coatings (simple aluminide MDC-210 or platinum modified MDC-150L) have been shown to exhibit superior oxidation resistance compared to similar coatings made by other aluminizing processes. A second significant source of impurities in platinum modified aluminide diffusion coatings is electroplating, that is, plating bath components (S, P, CI, K, Ca etc.) are codeposited with the platinum, and these impurities can have either a beneficial (K&Ca) or a detrimental (S,P&Cl) influence upon the oxidation resistance of the product coating. The results of investigations on the transport of impurities during aluminizing and electroplating, plus the influence of these impurities on oxidation resistance of the product coatings will be presented and discussed.

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Section: Presented At the International Gas Turbine And Aeroengine Congmentioning

confidence: 99%

Section: Presented At the International Gas Turbine And Aeroengine Congmentioning

confidence: 99%

Section: Electroplating Studymentioning

confidence: 99%

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