Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy

Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

“…The dissolution speed of the Cu substrate into liquid solder is rapid and it diffuses rapidly deep into the liquid phase, which result in the formation of interfacial IMC layer. With reference to the research on the interfacial reaction between Zn-Sn solder and the Cu substrate, [2][3][4][5] the IMC layer at the interface consists of three parts: the bamboo-shoot-like e-CuZn 5 near the solder side, the flat-layer-like b¢-CuZn near the Cu side, and the flat-layer-like c-Cu 5 Zn 8 in the middle. The b¢-CuZn layer thickness is very thin and is usually less than 1 lm, which is often ignored in the literature.…”

“…1 Zn-Sn-based solder does not generate intermetallic compounds (IMCs) and has advantages of an appropriate melting temperature range, better plasticity, better thermal/electrical conductivity and low cost, so it is an alloy that is most likely to replace high-lead solders. [2][3][4][5] To solve the problems of the poor wettability and poor oxidation resistance of the Zn-Sn-based solder, an alloying method may be used to improve its properties. 6 When a small amount of rare earth (RE) is added, the surface tension of Sn-Ag-Cu solder may be reduced during soldering, which promotes solder wetting on the substrate.…”

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

“…2B) (Moser et al, 1985), has been studied. This alloy system has the advantages of excellent thermal conductivity and mechanical properties (ductility and high ultimate tensile strength) and oxidation resistance in high-temperature highhumidity conditions (Lee et al, 2005;Santos et al, 2014). However, in addition to the corrosion problem due to zinc, there is a serious problem that the solidified solder joint returns to a solid+liquid mixed phase at the secondary reflow temperature (~250 o C), which is higher than the eutectic temperature of 199 o C (Fig.…”

In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI

“…[1][2][3][4][5][6][7]. Sn-Bi, Sn-Cu, Sn-Sb, Sn-Ag, Sn-Zn ve Au-Sn yanı sıra bu sistemlerin bazı üçlü ve dörtlü katkılanmış türevleri de literatürde tanımlanmıştır [8][9][10][11][12][13][14][15][16]. Kalay esaslı kurşunsuz lehimlerle ilgili çok sayıda araştırma yapılmasına rağmen, geleneksel Sn-Pb alaşımı tarafından sağlanan özelliklerin spektrumunu kapatabilecek henüz standart bir lehim alaşımı mevcut değildir [17].…”