2016
DOI: 10.7567/apex.9.084101
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Plasmonic photodetectors based on asymmetric nanogap electrodes

Abstract: Hot-electron-based solar energy conversion with metal-semiconductor nanodiodes Young Keun Lee, Hyosun Lee, Changhwan Lee et al. Advances in graphene-based optoelectronics, plasmonics and photonics Bich Ha Nguyen and Van Hieu Nguyen Photoresponse Enhancement in Graphene/Silicon Infrared Detector by Controlling Photocarrier Collection Xin Tang, Hengkai Zhang, Xiaobing Tang et al. Amplification of hot electron flow by the surface plasmon effect on metal-insulator-metal nanodiodes Changhwan Lee, Ievgen I Nedrygail… Show more

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Cited by 15 publications
(12 citation statements)
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“…Recently developed adhesion lithography [ 38–44 ] is generally used to produce coplanar material‐asymmetric nanogaps in geometrically symmetric side‐to‐side form, suffering from restricted materials and larger than 10 nm gap spacing. The direct electron‐beam lithography (EBL) [ 54 ] could enable coplanar geometrically asymmetric nanostructure but compromise significant limitations in terms of low‐throughput, poor scalability to large area and rough boundaries. Here, a novel fabrication process developed from our reported technique [ 55–57 ] is demonstrated to fabricate coplanar asymmetric tip‐to‐edge metal nanostructure with sub‐10 nm air channel and different tip‐to‐edge height.…”
Section: Resultsmentioning
confidence: 99%
“…Recently developed adhesion lithography [ 38–44 ] is generally used to produce coplanar material‐asymmetric nanogaps in geometrically symmetric side‐to‐side form, suffering from restricted materials and larger than 10 nm gap spacing. The direct electron‐beam lithography (EBL) [ 54 ] could enable coplanar geometrically asymmetric nanostructure but compromise significant limitations in terms of low‐throughput, poor scalability to large area and rough boundaries. Here, a novel fabrication process developed from our reported technique [ 55–57 ] is demonstrated to fabricate coplanar asymmetric tip‐to‐edge metal nanostructure with sub‐10 nm air channel and different tip‐to‐edge height.…”
Section: Resultsmentioning
confidence: 99%
“…Thus, the wide bandgap semiconductor materials cannot be applied in the fields of fiber optical communication and infrared detection. [ 285 ] Such limitation can be overcome by using subwavelength metallic structures that can excite SPs, thereby inducing a large amount of hot carriers. [ 45,46,286 ] This enables the infrared photodetection based on MSM‐PDs consisting of wide bandgap materials.…”
Section: Improving the Performances Of Msm‐pdsmentioning
confidence: 99%
“…Both 1D and 2D metallic gratings can be used as the electrodes of MSM‐PDs. [ 50,285 ] Initially, the hot carrier photodetectors were developed within the single Schottky‐contact type PDs. [ 287–291 ] In 2013, Knight and co‐workers demonstrated a Schottky‐contact type Si MSM‐PD with a top Au electrode in the form of a plasmonic grating.…”
Section: Improving the Performances Of Msm‐pdsmentioning
confidence: 99%
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“…Owing to its superior ability to significantly enhance the field strength and small size, nanogap has become an important element for construction of nanodevices for plasmonics, molecular sensing, photoelectronics, memorizers, , THz science, and metamaterials. , The challenge is to utilize its full potential for integrated applications, for example, on-chip integrated circuits. In the recent years, a variety of methods, such as electron beam lithography, focused ion beam etching (IBE), electromigration, break junction, , edge lithography, , angled deposition, and chemical synthesis, , have been employed to fabricate different nanogaps, although the controllability for making sub-10 nm gaps remains a challenge.…”
Section: Introductionmentioning
confidence: 99%