Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process

Godard, Maxime; Drouin, Dominique; Darnon, Maxime; Martel, Serge; Fortin, Clement

doi:10.1109/ectc.2018.00069

Cited by 10 publications

(2 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Godard et al [4] used Ar/H2 plasma because the generated hydrogen radicals act as reducing agents. The plasma treatment was performed in vacuum.…”

Section: Related Results In the Literaturementioning

confidence: 99%

Investigation of atmospheric pressure plasma treatment on PCB surface finishes

Kocsis,

Lukács,

Szalai

2023

Proceedings of the 19th IMEKO TC10 International Conference on Measurement for Diagnostics, Optimization and Control on Measure

View full text Add to dashboard Cite

Flux is a necessity in the lead-free soldering process. Inactivated flux residues can cause electrical shortages and functional issues by ion migration. Because of miniaturization and the complexity of recent electronic products a cleaner manufacturing process is required. Atmospheric pressure plasma treatment (PT) is a commonly applied surface cleaning method in the manufacturing industry and has been proved to be effective in improving the wettability in case of metal and polymer surfaces. Three different types of printed circuit board (PCB) surface finishes were investigated before and after plasma treatment. The aim of this study is to investigate the mechanisms of plasma cleaning and to possibly determine the root cause of the improvement of solderability on printed circuit boards resulting from atmospheric pressure plasma treatment. For this investigation of the PCB surface finishes, scanning electron microscopy (SEM) images were taken, and the composition of the surfaces were analyzed by energy dispersive X-ray spectrometry (EDAX) and laser-induced breakdown spectrometry (LIBS) as well.

show abstract

“…Godard et al [4] used Ar/H2 plasma because the generated hydrogen radicals act as reducing agents. The plasma treatment was performed in vacuum.…”

Section: Related Results In the Literaturementioning

confidence: 99%

Investigation of atmospheric pressure plasma treatment on PCB surface finishes

Kocsis,

Lukács,

Szalai

2023

Proceedings of the 19th IMEKO TC10 International Conference on Measurement for Diagnostics, Optimization and Control on Measure

View full text Add to dashboard Cite

show abstract

“…Important benefits -regarding the manufacturing industry -are the possibilities of automatization and in-line installation [5]. Forming gas that contains 5 vol% hydrogen and 95 vol% nitrogen was used for plasma generation, utilizing the reducing properties of hydrogen to remove the oxide layer from the metal surfaces [6].…”

Section: Introductionmentioning

confidence: 99%

Impact of plasma treatment on solderability of printed circuit boards

Kocsis

Lukács

Szalai

2022

IOP Conf. Ser.: Mater. Sci. Eng.

View full text Add to dashboard Cite

Flux is essential in the process of soldering. White flux residues are not only an aesthetic issue, but the inactivated components can cause severe problems. With miniaturization of products in the electronics industry, the short circuits caused by ion migration are more likely to occur during the lifetime of the product. Plasma treatment has been proved to be effective in improving the wettability in case of metal and polymer surfaces. The aim of this study is to investigate the possibility of promoting wettability of pads on printed circuit boards by plasma treatment. PCBs with three different types of surface finishes were investigated before and after plasma treatment. Wettability and solderability were examined by contact angle measurement and wetting balance tester. This method has the potential to reduce the usage of flux during soldering as an alternative surface treatment to create oxide-free metal surfaces.

show abstract