Impact of plasma treatment on solderability of printed circuit boards

Kocsis, E.; Lukács, A.; Szalai, I.

doi:10.1088/1757-899x/1246/1/012013

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…5) Overall, the results show that the residues of the WOAs used in no-clean fluxes can affect the electronic properties of board surfaces. Therefore, minimalization of the flux usage might be important [6] or post-cleaning methods [7] should be applied when electronics need to operate under safety-critical conditions.…”

Section: Fig 7 'Big Comb' Cleanliness Test Results (A) Optical Micros...mentioning

confidence: 99%

No-clean flux residues detection with impedance measurements

Tóth,

Kocsis,

Lukács

et al. 2023

Proceedings of the 19th IMEKO TC10 International Conference on Measurement for Diagnostics, Optimization and Control on Measure

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The no-clean flux-residues pose a high reliability risk, thus controlled strictly in the modern electronics assembly industry. A series of customized Surface Insulation Resistance (SIR) Experiments and AC impedance analysis under various test patterns demonstrate the dramatic impact of the partial activation of the fluxes unevaporated solvents, and non-decomposed activators on the reliability of the final assembly. Although the mainstream no-clean pastes and liquid fluxes are qualified under all the standard SIR and electrochemical migration (ECM) reliability tests, the solder mask filled SIR patterns are more realistic and the tests results more accurate. The spaces are filled with solder mask thus the ionic migration analysis is more complex. From this perspective, we demonstrate a thorough examination of these more realistic structures with classic DC SIR method and AC impedance measurements. This study examined the impact of no-clean flux residues on capacitance and resistance in case of solder mask filled comb patterns.

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Section: Fig 7 'Big Comb' Cleanliness Test Results (A) Optical Micros...mentioning

confidence: 99%

No-clean flux residues detection with impedance measurements

Tóth,

Kocsis,

Lukács

et al. 2023

Proceedings of the 19th IMEKO TC10 International Conference on Measurement for Diagnostics, Optimization and Control on Measure

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“…The impact of plasma treatment on solderability of printed circuit boards were demonstrated in a previous paper [5]. Wettability was compared by contact angle measurement as well as solderability by wetting balance testing.…”

Section: Related Results In the Literaturementioning

confidence: 99%

Investigation of atmospheric pressure plasma treatment on PCB surface finishes

Kocsis,

Lukács,

Szalai

2023

Proceedings of the 19th IMEKO TC10 International Conference on Measurement for Diagnostics, Optimization and Control on Measure

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Flux is a necessity in the lead-free soldering process. Inactivated flux residues can cause electrical shortages and functional issues by ion migration. Because of miniaturization and the complexity of recent electronic products a cleaner manufacturing process is required. Atmospheric pressure plasma treatment (PT) is a commonly applied surface cleaning method in the manufacturing industry and has been proved to be effective in improving the wettability in case of metal and polymer surfaces. Three different types of printed circuit board (PCB) surface finishes were investigated before and after plasma treatment. The aim of this study is to investigate the mechanisms of plasma cleaning and to possibly determine the root cause of the improvement of solderability on printed circuit boards resulting from atmospheric pressure plasma treatment. For this investigation of the PCB surface finishes, scanning electron microscopy (SEM) images were taken, and the composition of the surfaces were analyzed by energy dispersive X-ray spectrometry (EDAX) and laser-induced breakdown spectrometry (LIBS) as well.

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