Plasma polymerized styrene: A negative resist

Fong, F. O.

doi:10.1116/1.584002

Cited by 12 publications

(3 citation statements)

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“…Plasma polymer films, mainly deposited from methylmethacrylate, styrene or silicon organic monomers, are proposed as photoresists [90][91][92], electron beam resists [93][94][95][96][97] or resists for X-ray lithography [98], but also as films for gate insulators [99], intermediate layers [92] or surface passivation layers [100][101][102][103]. Plasma polymer films, mainly deposited from methylmethacrylate, styrene or silicon organic monomers, are proposed as photoresists [90][91][92], electron beam resists [93][94][95][96][97] or resists for X-ray lithography [98], but also as films for gate insulators [99], intermediate layers [92] or surface passivation layers [100][101][102][103].…”

Section: Plasma Polymerizationmentioning

confidence: 99%

Polymer Films with Embedded Metal Nanoparticles

Heilmann¹

2003

Springer Series in Materials Science

182

192

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Section: Plasma Polymerizationmentioning

confidence: 99%

Polymer Films with Embedded Metal Nanoparticles

Heilmann¹

2003

Springer Series in Materials Science

182

192

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“…For this example, reliable cuff diameters are obtained between 70 and 250 µm. After the cuff is fabricated, and gently unrolled, the electrodes lines are printed using large depth-of-field ion beam lithography in a negative-tone resist [7]- [8]- [9]. A 110 nm thick gold (Au) film is then deposited by DC-magnetron sputtering.…”

Section: Resultsmentioning

confidence: 99%

Self-closing Micro-Cuff for Neural Recording in the Locust

Sajedi¹,

Randhawa²,

Parikh³

et al. 2022

Proceedings of the 8th World Congress on New Technologies

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We have developed a self-wrapping flexible cuff electrode for recording electrical activity on the descending contralateral movement detector (DCMD) neuron of the locust. First, a gold film is sputtered onto a monoaxially oriented polycarbonate membrane. Then, the resulting bilayer film is cut into individual strips parallel to the machine direction of the polycarbonate film. Thermally shrinking the polycarbonate at 155 0 C actuates the curl. This method can be used to fabricate controlled diameters between 50-250 µm; diameter is controlled by thickness of the two layers and the temperature and duration of the heat shrinking process. The cuffs are selfclosing, and do not require suturing for attachment to a nerve. The cuffs are carefully unrolled, a gold film deposited, and a plasmadeposited, ion-sensitive resist applied. A stencil mask is then used to define the metallization lines by 50 kV He + ion beam proximity lithography. Ion milling transfers the resist pattern to the metal film. Conformality of the resist and large depth-of-field of the lithography are key to high resolution patterning on these non-flat substrates. The dielectric overcoat is a layer of exposed resist, which simplifies the opening of the contact windows, and provides excellent biocompatibility.

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“…Organic resists are preferable to inorganic resists for the fabrication process because organic resists can be removed selectively using an organic solvent or via O 2 plasma treatment. A previous study has reported that poly-methyl methacrylate as positive EB resist 14 and poly-styrene as negative resist 15 can be deposited by plasma polymerization deposition. However, plasma polymerization deposition causes undesirable side reactions such as cross-linking.…”

Section: Introductionmentioning

confidence: 99%

Conformal coating of poly-glycidyl methacrylate as lithographic polymer via initiated chemical vapor deposition

Yoshida

Kobayashi

Kumano

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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Abstract. This study reports on the investigation of the potential applicability of poly-glycidyl methacrylate (PGMA) films deposited via initiated chemical vapor deposition (i-CVD) as lithographic resists in the microfabrication of non-planar structures. We investigate the appropriate deposition conditions of i-CVD required to form PGMA films with smooth surfaces. As a result, under the optimal conditions determined by us, we fabricate films with nanometer-scale flat surfaces. Subsequently, we demonstrate that i-CVD is effective for conformally coating a highaspect-ratio Si trench with PGMA film via our deposition experiments. In our deep-ultraviolet lithography experiment, we successfully fabricate a fine 20-μm line-and-space (L∕S) pattern with a height of approximately 1 μm. Furthermore, in our electron-beam (EB) lithography experiment, we define a fine 350-nm L∕S pattern with a height of 120 nm. In addition, the i-CVD process can be used to form highly-sensitive EB resist films; the lowest dose amount for patterning these films is evaluated to be less than 0.01 μC∕cm 2 . Our results demonstrate that i-CVD is a potentially powerful method to conformally coat lithographic resist films on threedimensional structures.

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Plasma polymerized styrene: A negative resist

Cited by 12 publications

References 0 publications

Polymer Films with Embedded Metal Nanoparticles

Polymer Films with Embedded Metal Nanoparticles

Self-closing Micro-Cuff for Neural Recording in the Locust

Conformal coating of poly-glycidyl methacrylate as lithographic polymer via initiated chemical vapor deposition

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