Plasma planarization for sensor applications

Li, Y.X.; French, P.J.; Wolffenbuttel, R.F.

doi:10.1109/84.465122

Cited by 17 publications

(13 citation statements)

References 26 publications

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“…Similarly, surface planarity and roughness are of crucial interest for optical MEMS devices. MEMS researchers have demonstrated success with local planarization techniques for some sensor applications [5,6]. The challenge in using CMP for MEMS is that structures with multiple structural levels often have several micrometers of built-up topography.…”

Section: Introductionmentioning

confidence: 99%

A design-based approach to planarization in multilayer surface micromachining

Mali

Bifano²,

Koester³

1999

J. Micromech. Microeng.

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This paper describes a design-based planarization strategy that can control topography to within submicron levels. The design concept takes advantage of the inherent conformability of the film deposition processes to achieve planar topography, without the need for an additional planarization step. It is based on a universally regulating line spacing in patterned layers to within a predefined amount, thus allowing subsequent layers to fill in as they grow, conforming to the previous layer. Test structures were fabricated to study the effect of different feature sizes in underlying layers on the topography of subsequent layers. Predictions based on numerical and geometric models for topography generation are compared to fabricated devices. An example of successful application to a micromachined adaptive mirror is presented.

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Section: Introductionmentioning

confidence: 99%

A design-based approach to planarization in multilayer surface micromachining

Mali

Bifano²,

Koester³

1999

J. Micromech. Microeng.

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“…To adopt this technique for the waveguides, for the unevenness of ∼5 μm, etching with two sacrificial layers is also reported. 25 Ruano et al 26 reported monolithic integration of waveguide and microfluidic system including microchannel and liquid reservoirs by depositing glass using flame hydrolysis deposition (FHD) and etching with deep reactive ion etching (DRIE), followed by sealing the device with the help of two PDMS layers. Herein, to get a hermetic sealing, a thin flexible PDMS layer is bonded between the nonplanar waveguide and a thick PDMS layer containing the fluidic ports.…”

Section: Silica-on-silicon Waveguidementioning

confidence: 99%

Silica-on-silicon waveguide integrated polydimethylsiloxane lab-on-a-chip for quantum dot fluorescence bio-detection

Ozhikandathil¹,

Packirisamy²

2012

J. Biomed. Opt.

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Integration of microfluidics and optical components is an essential requirement for the realization of optical detection in lab-on-a-chip (LOC). In this work, a novel hybrid integration of silica-on-silicon (SOS) waveguide and polydymethylsiloxane (PDMS) microfluidics for realizing optical detection based biochip is demonstrated. SOS is a commonly used platform for integrated photonic circuits due to its lower absorption coefficient of silica and the availability of advanced microfabrication technologies for fabricating complicated optical components. However, the fabrication of complex microfluidics circuits on SOS is an expensive process. On the other hand, any complex 3D and high-aspect-ratio microstructures for the microfluidic applications can be easily patterned on PDMS using soft lithography. By exploring the advantages of these two materials, the proposed hybrid integration method greatly simplifies the fabrication of optical LOC. Two simple technologies--namely, diamond machining and soft lithography--were employed for the integration of an optical microfluidic system. Use of PDMS for the fabrication of any complex 3D microfluidics structures, together with the integration of low loss silica-on-silicon photonic waveguides with a straight microfluidic channel, opens up new possibilities to produce low-cost biochips. The performance of SOS-PDMS-integrated hybrid biochip is demonstrated with the detection of laser induced fluorescence of quantum dots. As quantum dots have immense application potential for biodetection, they are used for the demonstration of biodetection.

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“…Some processes such as BPSG reflow, spin-onglass and plasma etching can only smooth over the local features and fail to deliver the desired planarity across the wafer. Li, et al , 6 proposed a plasma planarization method with two photoresist layers as a means to fabricate a planarized PSG trench in a silicon substrate. However, this method requires equal etching rates between the two photoresists and the PSG film and can, therefore, only be used in limited material sets.…”

Section: Introductionmentioning

confidence: 99%

Chemical Mechanical Planarization of large area well for MEMS and MOEMS

et al. 2003

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MEMS and other emerging applications such as planar photonic devices, display devices and advanced chip and wafer level packaging, require superior planarity of thin films in order to enable greater functionality. The only process technology shown to consistently deliver both global and local planarity is Chemical Mechanical Planarization (CMP). CMP was initially developed to meet the increasingly stringent planarity requirements of the integrated circuit (IC) industry and has since become the standard planarization process within the semiconductor industry. However, emerging applications share film characteristics that present planarization challenges quite different from the traditional IC applications, including: 1) much larger step heights and wider feature sizes, 2) thicker films, 3) multiple materials present within the same layer, and 4) large variations in pattern densities and feature sizes. Due to these challenges, standard CMP process steps, alone, may not be able to deliver the desired planarity. In this paper, other techniques in combination with standard CMP will be investigated as a means to meet stringent planarity requirements of MOEMS. These techniques include: (a) optimizing CMP slurry formulation for both material removal rate and material selectivity, (b) integrating various technologies such as additional etch steps, protective masks and lift-off processes to deliver a surface that is more complementary to CMP, and (c) developing a two-step CMP process with a bulk removal step followed by a soft landing step. A working example will also be presented to demonstrate the feasibility of the proposed methodology.

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Plasma planarization for sensor applications

Cited by 17 publications

References 26 publications

A design-based approach to planarization in multilayer surface micromachining

A design-based approach to planarization in multilayer surface micromachining

Silica-on-silicon waveguide integrated polydimethylsiloxane lab-on-a-chip for quantum dot fluorescence bio-detection

Chemical Mechanical Planarization of large area well for MEMS and MOEMS

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