2013
DOI: 10.1116/1.4819316
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Plasma etching: Yesterday, today, and tomorrow

Abstract: The field of plasma etching is reviewed. Plasma etching, a revolutionary extension of the technique of physical sputtering, was introduced to integrated circuit manufacturing as early as the mid 1960s and more widely in the early 1970s, in an effort to reduce liquid waste disposal in manufacturing and achieve selectivities that were difficult to obtain with wet chemistry. Quickly,the ability to anisotropically etch silicon, aluminum, and silicon dioxide in plasmas became the breakthrough that allowed the featu… Show more

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Cited by 607 publications
(434 citation statements)
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References 333 publications
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“…Fig. 12 shows results for NF 2 , for which no experimental data were available. The predictions were generated by Tennyson and collaborators (42) using the UK molecular R-matrix codes (43).…”
Section: Connecting Fundamental Data With Modeling Applicationsmentioning
confidence: 99%
See 1 more Smart Citation
“…Fig. 12 shows results for NF 2 , for which no experimental data were available. The predictions were generated by Tennyson and collaborators (42) using the UK molecular R-matrix codes (43).…”
Section: Connecting Fundamental Data With Modeling Applicationsmentioning
confidence: 99%
“…Those activated species are then used in applications ranging from microelectronics fabrication (2) to human healthcare (3). The most basic, necessary, and first step in the development of those technologies is the electron or ion impact with the initially unreactive species to produce the activated species.…”
Section: The Need For Atomic and Molecular Datamentioning
confidence: 99%
“…From the mid-1960s, the mechanisms of plasma etching were first introduced as a revolutionary technique for the fabrication of integrated circuit [46]. In the 1970s, it was widely accepted and expected to be an important fabrication technique in the industry of semiconductor and other applications requiring fine-line lithography [47].…”
Section: Plasma Etchingmentioning
confidence: 99%
“…Ceramics such as sintered alumina are thermally and chemically resistant and can withstand temperatures as high as 42000°C (Ref. 42) and aggressive applications in, for example, oven linings and plasma-etching equipment 43 . Some ceramics are also piezoelectrics and can therefore be applied in both sensors and microactuators.…”
Section: Precision In Harsh Environments P French Et Almentioning
confidence: 99%