2007
DOI: 10.1143/jjap.46.4064
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Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-k/Cu Interconnects

Abstract: A plasma-enhanced co-polymerization technique was developed for low-k/Cu damascene integration on 300 mm wafers. This technique enables us to control dielectric film properties by introducing organo-siloxane and hydrocarbon into a He-plasma. The growth rate of the low-k film derived from divinyl siloxane–benzocyclobutene (DVS–BCB) as a matrix monomer is increased by adding C2H2 as a deposition acceleration monomer and the Young's modulus was enhanced by adding diisopropenylbenzene (DIPB) or divinylbenzene (DVB… Show more

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Cited by 6 publications
(5 citation statements)
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“…Knowing the contribution of , we then arrive at a value of ~1.7 eV for the activation energy of C i injection ( ) in a close agreement with the activation energy for the flux of injected C i reported in Ref. [12]. The deduced activation energy for V C migration ( ) is ~2.5 eV as shown in Fig.…”
Section: Kinetics Modelsupporting
confidence: 84%
“…Knowing the contribution of , we then arrive at a value of ~1.7 eV for the activation energy of C i injection ( ) in a close agreement with the activation energy for the flux of injected C i reported in Ref. [12]. The deduced activation energy for V C migration ( ) is ~2.5 eV as shown in Fig.…”
Section: Kinetics Modelsupporting
confidence: 84%
“…The plasmaenhanced copolymerization of DVS-BCB with divinylbenzene (DVB) or diisopropenylbenzene (DIPB) allows control of the mechanical strength at equivalent dielectric constant. 174 In summary, the process conditions in PECVD deposited films (plasma power, deposition temperature, chamber pressure, addition of an oxidant, etc.) are the key parameters to optimize film properties, the boundaries of which are controlled by the precursor structure and chemical composition.…”
Section: Inorganics: Sicohmentioning
confidence: 99%
“…An interesting example is provided by Kawahara et al who designed an exotic hybrid precursor with cross-linking functionalities, i.e., divinyl siloxane−benzocyclobutene (DVS−BCB). The plasma-enhanced copolymerization of DVS−BCB with divinylbenzene (DVB) or diisopropenylbenzene (DIPB) allows control of the mechanical strength at equivalent dielectric constant …”
Section: Materials 33 > K > 27mentioning
confidence: 99%
“…Investigation of carbon clusters is also of high importance. With the thermal oxidation of SiC, some portion of carbon atoms is known to diffuse into the bulk SiC region [35][36] to fill in the carbon vacancy (VC). [37][38] As for calculations of carbon clusters in SiC, charge transition levels and dissociation energy (i.e., an energy to remove a single carbon atom from a defect) for carbon interstitial clusters in 3C-SiC and for di-interstitials in 4H-SiC were investigated based on the LDA, 25) and formation energies of carbon clusters in 3C-and 4H-SiC were reported based on the mixed LDA-exact exchange calculation.…”
Section: Introductionmentioning
confidence: 99%