2019
DOI: 10.1116/1.5079553
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Plasma enhanced atomic layer deposition of gallium sulfide thin films

Abstract: Gallium sulfide has a great potential for optoelectronic and energy storage applications. Since most of these applications require a high control over the layer thickness or a high conformality, atomic layer deposition is a promising deposition technique. In this work, the authors present a novel plasma enhanced atomic layer deposition process for gallium sulfide based on trimethylgallium and H 2 S/Ar plasma. The growth was characterized using in situ spectroscopic ellipsometry. It was found that the process g… Show more

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Cited by 18 publications
(6 citation statements)
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“…For example, by using hexakis-(dimethylamido)digallium and hydrogen sulfide, Meng et al 151 observed the self-limiting growth of GaS x films with a thickness of 20−30 nm in the temperature range of 125−225 °C. Kuhs et al 152 also achieved the self-limiting growth of GaS x films using trimethylgallium and H 2 S/Ar plasma with a temperature range from 70 to 350 °C. However, a low growth temperature is unfavorable for the formation of thermodynamically stable products and defects, and disorder is usually common in lowtemperature growth, which can degrade their electrical properties.…”
Section: Synthesismentioning
confidence: 99%
“…For example, by using hexakis-(dimethylamido)digallium and hydrogen sulfide, Meng et al 151 observed the self-limiting growth of GaS x films with a thickness of 20−30 nm in the temperature range of 125−225 °C. Kuhs et al 152 also achieved the self-limiting growth of GaS x films using trimethylgallium and H 2 S/Ar plasma with a temperature range from 70 to 350 °C. However, a low growth temperature is unfavorable for the formation of thermodynamically stable products and defects, and disorder is usually common in lowtemperature growth, which can degrade their electrical properties.…”
Section: Synthesismentioning
confidence: 99%
“…Modern analytical techniques have opened a new wave of technologies that is permitting a wider spreading of aluminum chalcogenide‐based thin film, presenting controllable thickness (and consequent growth per cycle) when prepared by ALD (atomic layer deposition). [ 138,199,200 ] In 2018 Kuhs, Hens, and Detavernier, using a plasma‐enhanced ALD technique, have prepared amorphous pinhole‐free aluminum sulfides using a reaction combustion in which CS 2 was detected by in situ mass spectrometry and whose composition was obtained from ex situ X‐ray photoelectron spectroscopy (XPS) measurements, [ 200 ] where Figure summarizes the principal findings of this group. Meng et al., in 2017, have used a similar approach, but used instead dimethylamido aluminum.…”
Section: Aluminum Chalcogenidesmentioning
confidence: 99%
“…However, the resulting film in in all cases, despite being pinhole‐free, at the same time presented an amorphous, AlS x composition. [ 200 ] The first group, however to report similar technique, were Sinha, Mahuli, and Sarkar. [ 201 ] In this early study, the conditions of preparing such films were much harsher, with thicker film formation.…”
Section: Aluminum Chalcogenidesmentioning
confidence: 99%
“…Recent works using the PE-ALD technique have shown significant advancements in tailoring material properties and refining processing conditions. [22][23][24] This inspired us to attempt the PE-ALD approach by combining the same Ga source reported by Meng et al 7 ie., Ga2(NMe2)6 in combination with H2S plasma as co-reactant to deposit high-quality crystalline gallium sulfide thin films. To our knowledge, depositing crystalline gallium sulfide films using the ALD…”
Section: Reported Thermal Ald Aimingmentioning
confidence: 99%