Plasma deposition of (Ti,Al)N coatings at various magnetron discharge power levels

Tungsten doped chromium nitride coatings

“…The roughness decreased to a critical value and then increased with increasing tungsten content, coincident in the tendency of the grain size shown in Fig. 6 [19,20]. …”

“…1) is similar to that of the TiN films. An increase in magnetron discharge power corresponded to an increase in the flux of substrate bombarding particles caused by the larger degree of ionization of the magnetron discharge [19]. Therefore, the (200) preferred orientation in Cr 1 − x W x N y films with different discharge powers resulted from the increase in incidental ion-flux and the open channeling direction effect.…”

Investigation of deposition parameters on the structural properties and hardness of TiAlN films deposited via reactive pulsed DC magnetron sputteringInvestigation of deposition parameters on structural properties and hardness of TiAlN films deposited by reactive pulsed DC magnetron sputtering

“…Hakansson et al [3] found that a higher bias voltage produced fine grains with reduced porosity and interrupted the columnar structure of the TiAlN film. Gredic and Zlatanovic [4] revealed that the deposition rate, aluminum to titanium ratio, and metal to nitrogen ratio of TiAlN films increased with higher sputtering power. Jalali et al [5] reported that the crystallinity of TiAlN films can be improved from amorphous to crystalline structure when increasing the substrate temperature at 400C.…”

AlxTi1−xN hard coatings synthesized by reactive sputtering using mosaic target

“…In the case of reactive sputtering, it becomes even more complicated because each component on the mosaic target has different reactive conditions with the gas. The changes in partial pressure of reactive gas will lead to a great variation in deposition rate, composition, microstructure and mechanical properties of the coatings [1,7,8]. In this paper, the effects of N 2 partial pressure on the microstructure and mechanical properties of reactively sputtered Al x Ti 1−x N coatings by mosaic target were studied.…”

“…In this technique, composite target, usually including alloy target and mosaic target, is commonly used. Compared with alloy target that is prepared using cast and powder metallurgical methods, mosaic target is more convenient to fabricate [7][8][9]. However, during the process of sputtering, the situation is more complicated for mosaic target.…”