Plasma-assisted quartz-to-quartz direct bonding for the fabrication of a multilayered quartz template for nanoimprint lithography

Lee, Jihye; Ali, Altun; Kim, Ki-don; Kim, Jae Hyun; Choi, Dae-guen; Choi, Jun-Hyuk; Jeong, Jun‐Ho

doi:10.1088/0960-1317/20/4/045005

Cited by 6 publications

(4 citation statements)

References 18 publications

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“…[9][10][11][12][13][14] Smooth interfaces have been obtained with this method, even at room temperature. However, it requires more rigorous conditions than the traditional fusion bonding method.…”

Section: Introductionmentioning

confidence: 95%

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Low temperature direct bonding of silica glass via wet chemical surface activation

Mai

Yang

2015

RSC Adv.

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Silica glass pairs were directly bonded by wet chemical surface activation at a low temperature. A smooth joint interface with no voids and micro cracks was obtained with the assistance of a 250 C heat treatment and a pressure of $30 MPa, and the excellent transmittance of the bonded pair was demonstrated by UV-Vis absorptions. This new method can tolerate a silica glass surface roughness as high as 6 nm. A demo chip with a microfluidic channel was also prepared by this method. A modified model for the glass-to-glass bonding mechanism is proposed based on the surface and interface characterization. Raman scattering analysis showed that Si-O-Si linkages at the silica glass surface were broken, and colloid-like hydrolyzed layers formed on the glass surface after the activation treatment. TEM and EELS results revealed that the 3D glass structure of the Si-O-Si linkages formed again at the interface of the directly bonded silica glass pairs after low-temperature annealing.

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Section: Introductionmentioning

confidence: 95%

“…At present, some research organizations use the plasmaactivated direct bonding method to bond glass and silicon wafers. [9][10][11][12][13][14] Smooth interfaces have been obtained with this method, even at room temperature. However, it requires more rigorous conditions than the traditional fusion bonding method.…”

Section: Introductionmentioning

confidence: 95%

Low temperature direct bonding of silica glass via wet chemical surface activation

Mai

Yang

2015

RSC Adv.

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“…The plasma activation bonding method is a direct bonding method widely studied for various dielectric materials including glass-glass bonding and SiO 2 -SiO 2 bonding. [17][18][19] This bonding technique is typically based on the hydrophilic bonding mechanisms, in which hydroxyl groups on the opposing plasma-activated wafers contribute to the bond formation after post-bonding annealing. 20,21) A remaining problem of the conventional plasma activation bonding method is the relatively low bond energy after post-bonding annealing at temperatures below 250 °C.…”

Section: Introductionmentioning

confidence: 99%

Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C

Yamauchi²,

Suga

2018

Jpn. J. Appl. Phys.

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We present our newly developed sequential plasma activation methods for hydrophilic direct bonding of silica glasses and thermally grown SiO2 films. N2 plasma was employed to introduce a metastable oxynitride layer on wafer surfaces for the improvement of bond energy. By using either O2-plasma/N2-plasma/N-radical or N2-plasma/N-radical sequential activation, the quartz–quartz bond energy was increased from 2.7 J/m2 to close to the quartz bulk fracture energy that was estimated to be around 9.0 J/m2 after post-bonding annealing at 200 °C. The silicon bulklike bond energy between thermal SiO2 films was also obtained. We suggest that the improvement is attributable to surface modification such as N-related defect formation and asperity softening by the N2 plasma surface treatment.

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“…Another cost-efficient solution are bonded nanoimprint molds (BIMs). 5,33,34) To realize BIMs, a structured chip or insert is bonded to a support (see Fig. 1).…”

Section: Introductionmentioning

confidence: 99%

Degradation of Perfluorotrichlorosilane Antisticking Layers: The Impact on Mold Cleaning, Ultraviolet-Nanoimprinting, and Bonded Ultraviolet-Nanoimprint Molds

Kirchner¹,

Teng²,

Lü³

et al. 2011

Jpn. J. Appl. Phys.

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A reduction of the adhesion between imprint resist and mold is crucial for defect free imprints and is commonly achieved by silane based antisticking layers. Highly stable antisticking layers are required for high throughputs and long imprint mold lifetimes. Hybrid nanoimprint molds avoid the imprint inherent residual polymer layer in UV-assisted nanoimprinting. Such hybrid molds have chemically heterogeneous surfaces of silica and, e.g., chromium oxide regions. The chemical stability of vapor-coated 1H,1H,2H,2H-perfluorodecyltrichlorosilane antisticking layers against acetone, acidic piranha, reactive ion etching and UV-assisted nanoimprinting was investigated. To evaluate the behavior of hybrid mold surfaces, flat silica and antireflective chromium-oxynitride surfaces were used. The antisticking layer on both surfaces was highly chemical resistant against acetone. A continuous antisticking layer degradation with a surface free energy increase of 0.9 mN/m per 10 min piranha treatment and 1.2 mN/m per 10 subsequent UV-assisted imprints was found for silica surfaces. On the chromium surfaces, the antisticking layer quality was much lower than on fused silica and degraded much faster. The surface free energy of silane coated chromium surfaces was increased by 2.3 mN/m after 10 imprints and the antisticking layer was completely degraded after a single 10 min piranha cleaning step. The lower antisticking layer quality on antireflective chromium was attributed to the surface itself. Additionally, the high chemical resistance of the vapor coated silane was used to successfully protect the adhesive joints of cost-efficient, adhesively bonded nanoimprint molds from being degraded by acidic piranha during mold cleaning. This can significantly increase the life-time of such bonded molds.

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Plasma-assisted quartz-to-quartz direct bonding for the fabrication of a multilayered quartz template for nanoimprint lithography

Cited by 6 publications

References 18 publications

Low temperature direct bonding of silica glass via wet chemical surface activation

Low temperature direct bonding of silica glass via wet chemical surface activation

Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C

Degradation of Perfluorotrichlorosilane Antisticking Layers: The Impact on Mold Cleaning, Ultraviolet-Nanoimprinting, and Bonded Ultraviolet-Nanoimprint Molds

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