Alternative Lithographic Technologies IV 2012
DOI: 10.1117/12.916748
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Planarization coating for polyimide substrates used in roll-to-roll fabrication of active matrix backplanes for flexible displays

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Cited by 3 publications
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“…This material has a good transparency and relatively low cost but it has a high density of "pits" from fillers and belt marks and other defects from dust and surface scratching. These features are believed to be a source of shunt defects in the dielectric [11]. Hence, the surface quality needs to be improved to reduce possible defects to an acceptable level.…”
Section: Barrier Film Fabrication Processmentioning
confidence: 99%
“…This material has a good transparency and relatively low cost but it has a high density of "pits" from fillers and belt marks and other defects from dust and surface scratching. These features are believed to be a source of shunt defects in the dielectric [11]. Hence, the surface quality needs to be improved to reduce possible defects to an acceptable level.…”
Section: Barrier Film Fabrication Processmentioning
confidence: 99%
“…This could result in dramatically lower fabrication costs since rollto-roll processing is steady-state and avoids many of the handling complications that are associated with traditional batch processing, and thus enables a higher throughput. 3) This semi-finished material of copper-polyimide reduces the amount of residual NMP solvent produced during the heat treatment process. The construction of this material incorporates copper and polyimide film without any resin.…”
Section: Introductionmentioning
confidence: 99%