Optical Fiber Telecommunications v A 2008
DOI: 10.1016/b978-0-12-374171-4.00009-5
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Planar lightwave circuits in fiber-optic communications

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Cited by 17 publications
(5 citation statements)
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“…where h and p are the very popular parameters, defining the guided mode field in the literature on optical waveguides [1,2]. V is the product of three elements: the numerical aperture n 2 1 − n 2 2 of a symmetric planar waveguide, d is the radius (or half a width) of the waveguide core, and k 0 is the wave number in the air.…”
Section: Analysis For the Pl Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…where h and p are the very popular parameters, defining the guided mode field in the literature on optical waveguides [1,2]. V is the product of three elements: the numerical aperture n 2 1 − n 2 2 of a symmetric planar waveguide, d is the radius (or half a width) of the waveguide core, and k 0 is the wave number in the air.…”
Section: Analysis For the Pl Modelmentioning
confidence: 99%
“…Higher and higher integration density is the long-standing goal of the optical integrated circuits in the modern optical communications systems [1,2]. Since the beginning of the 21st century, the silicon-on-insulator (SOI) waveguide-based photonic integrated circuits (PIC) have shown unprecedented potential.…”
Section: Introductionmentioning
confidence: 99%
“…The simplest structure of the CPM which only includes SOA and SA sections allows the implementation on a photonic integrated circuit (PIC) [26]. The PICs which use active-passive integration, enable increased functionality and circuit reliability, while reducing their size, power, and cost [27], [28]. Also, the active-passive integration allows to set the length of the gain sections and adjust the length of the resonator cavity by changing the length of the passive sections in order to meet the specification of the required repetition rate for a particular application, independent from the ratio between the lengths of the gain and absorber sections [14].…”
Section: Introductionmentioning
confidence: 99%
“…As the technology matures, increasing numbers of component-level interconnections are made at the wafer scale. This enables sustained increases in the functionality, performance, and reliability of circuits, while reducing their size, power, and cost [1]. As technology matures, integrated circuit products outperform equivalent combinations of discrete components at the functional level.…”
Section: Introductionmentioning
confidence: 99%