2014
DOI: 10.1002/fuce.201300224
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Planar High Temperature Heat Pipes for SOFC/SOEC Stack Applications

Abstract: Targeting transient operation of high temperature solid oxide cell (SOC) systems this paper proposes an enhanced heat management mechanism using planar high temperature heat pipes that can be integrated into the SOC‐stack structure. Flat heat pipes with thicknesses down to 4 mm filled with liquid alkali metals for almost isothermal 2D heat spreading, even for intense heat transfer rates, are demonstrated. A new pathway towards a temperature gradient shrinking in SOC‐stacks without using large amounts of additi… Show more

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Cited by 52 publications
(16 citation statements)
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“…( 5 ), provided that the contact angles of the respective fluids on the wick surface are known: If it is assumed that there is no evaporation of liquid from the wick, the maximum rise of liquid in the wick can be determined by balancing the capillary pressure to the hydrostatic pressure of the liquid in the wick [14]:…”
Section: Theorymentioning
confidence: 99%
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“…( 5 ), provided that the contact angles of the respective fluids on the wick surface are known: If it is assumed that there is no evaporation of liquid from the wick, the maximum rise of liquid in the wick can be determined by balancing the capillary pressure to the hydrostatic pressure of the liquid in the wick [14]:…”
Section: Theorymentioning
confidence: 99%
“…( 5 ). From the contact angle calculations performed, a contact angle of 58.4º was used for the heptane on the wick surface.…”
Section: Calculated Heat Transfer Capacity With Potassiummentioning
confidence: 99%
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“…Heat pipe interconnector design bases on the planar heat pipe design developed at the institute of energy process engineering (EVT) 18. The casing was milled into CROFER 22H sheets, with the flow fields machined on the external side.…”
Section: Heat Pipe Interconnectorsmentioning
confidence: 99%
“…Figure 1 explains the basic idea behind this concept. The heat pipe functionality is directly incorporated into the flat metal interconnectors 18, which are stacked into the SOC stack among normal interconnectors with a certain frequency. Thus, these heat pipes are in close thermal contact to the planar SOC cells.…”
Section: Introductionmentioning
confidence: 99%