2015
DOI: 10.1016/j.diamond.2015.10.007
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Piezoresistive properties of diamond like carbon films containing copper

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Cited by 18 publications
(22 citation statements)
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“…The shell structure theory states that the resistivity of any conductive composite is affected by the application of external pressure, due to the formation and destruction of conductive networks. A similar mechanism has been published previously by utilizing copper in the case of carbon-like diamond composites [21] or in carbon nanotubes composites in a wide range of polymer composites materials [22]. In this study, the pressure sensitivity was heightened by using increasing amounts of fillers, which resulted in a large number of filler-filler and filler-polymer interactions.…”
Section: Resultssupporting
confidence: 72%
“…The shell structure theory states that the resistivity of any conductive composite is affected by the application of external pressure, due to the formation and destruction of conductive networks. A similar mechanism has been published previously by utilizing copper in the case of carbon-like diamond composites [21] or in carbon nanotubes composites in a wide range of polymer composites materials [22]. In this study, the pressure sensitivity was heightened by using increasing amounts of fillers, which resulted in a large number of filler-filler and filler-polymer interactions.…”
Section: Resultssupporting
confidence: 72%
“…A full review of these applications would be out of the scope of this paper, so only a few examples will be given. The usage of HPPMS has been demonstrated for different applications such as hard coatings [2][3][4], optical thin films [5][6][7], electrical applications [8][9][10], catalysis [11][12][13], adhesive and/or low friction coatings [14,15], anti-bacterial thin films [16], and conformal coatings [17]. The technique has introduced also some interesting new insight in terms of plasma physics which are presented in a large number of scientific papers, and summarized in a few highly cited reviews [5,[18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…First, intrinsic piezoresistive materials with high gauge factor (the specific value of resistance variation against strain), such as silicon film and carbon film, were used. [18,19] Although the GF of these materials can reach more than 2000, sensors made of these materials can only apply to small-strain environments due to the fragility of the materials. [20] Another avenue is to introduce microstructures, such as pyramid, [21] in the piezoresistive sensors to enhance the change of electrical contact resistance (ECR).…”
Section: Introductionmentioning
confidence: 99%