Comparative studies for TiO 2 -passivated Al 0.25 Ga 0.75 N/GaN heterostructure FETs (HFETs) and TiO 2 -dielectric MOS-HFETs using nonvacuum ultrasonic spray pyrolysis deposition technique are made. Optimum device performances are obtained by tuning the layer thickness of TiO 2 to 20 nm. High relative permittivity (k) of 53.6 and thin effective oxide thickness of 1.45 nm are also obtained. Pulse-IV, Hooge coefficient (α H ), Transmission Electron Microscopy, and atomic force microscope have been performed to characterize the interface, atomic composition, and surface flatness of the TiO 2 oxide. Superior improvements for the present TiO 2 -dielectric MOS-HFET/TiO 2 -passivated HFETs are obtained, including 47.6%/23.8% in two-terminal gate-drain breakdown voltage (BV GD ), 111%/22.2% in two-terminal gate-drain turn-ON voltage (V ON ), 47.9%/39.4% in ON-state breakdown (BV DS ), 12.2%/10.2% in drain-source current density (I DS ) at V GS = 0 V (I DSS0 ), 27.2%/11.7% in maximum I DS (I DS,max ), 3/1-order enhancement in ON/OFF current ratio (I ON /I OFF ), 58.8%/17.6% in gate-voltage swing linearity, 25.1%/13.2% in unity-gain cutoff frequency ( f T ), 40.6%/24.7% in maximum oscillation frequency ( f max ), and 33.8%/15.6% in power-added efficiency with respect to a Schottky-gated HFET fabricated on the identical epitaxial structure. The present MOS-HFET has also shown stable electrical performances when the ambient temperature is varied from 300 to 450 K. Index Terms-AlGaN/GaN/Si, high temperature, MOS-heterostructure FET (HFET), passivation, TiO 2 , ultrasonic spray pyrolysis deposition (USPD).