2017
DOI: 10.31399/asm.cp.istfa2017p0228
|View full text |Cite
|
Sign up to set email alerts
|

Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope

Abstract: We present an upgraded time-resolved LADA system, with a 25ps pulsed laser, integrated into a commercial laser scanning microscope used in failure analysis. We demonstrate the use of this system on 14nm/16nm finfet devices.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2018
2018
2018
2018

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 0 publications
0
1
0
Order By: Relevance
“…The pulsed laser SEE test method is widely accepted as non-cumulative as it does not induce permanent damages (displacement damage and total ionizing dose) which were commonly induced [4][5][6] during particle radiation tests. In addition, in the field of failure analysis, picosecond 1064 nm pulsed laser techniques have recently been demonstrated as a useful tool to conduct time resolved laser assisted device alteration analysis [7]. With the aggressive scaling down in technology nodes, advanced microelectronic devices utilize new materials and processing methods, of which, the full comprehension on material reactions and reliability can be difficult to accomplish.…”
Section: Introductionmentioning
confidence: 99%
“…The pulsed laser SEE test method is widely accepted as non-cumulative as it does not induce permanent damages (displacement damage and total ionizing dose) which were commonly induced [4][5][6] during particle radiation tests. In addition, in the field of failure analysis, picosecond 1064 nm pulsed laser techniques have recently been demonstrated as a useful tool to conduct time resolved laser assisted device alteration analysis [7]. With the aggressive scaling down in technology nodes, advanced microelectronic devices utilize new materials and processing methods, of which, the full comprehension on material reactions and reliability can be difficult to accomplish.…”
Section: Introductionmentioning
confidence: 99%