Picosecond Laser Structuring Technology for LTCC - the Improvement of Fine Line Structuring

Gutzeit, Nam; Schulz, Alexander; Fischer, M.; Thelemann, Torsten; Müller, Jens

doi:10.23919/empc44848.2019.8951813

Cited by 2 publications

(7 citation statements)

References 9 publications

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“…The spot diameter was 120 μm. The parameters are based on the findings from preliminary work 47,48 and other studies on laser processing of LTCC 40–43,54–56 . In particular, when CO 2 lasers are used, a high amount of thermal energy is dissipated into the surrounding areas of the LTCC substrate due to the large wavelength and long pulse durations 40 .…”

Section: Methodsmentioning

confidence: 99%

“…The laser material processing of LTCC substrates is an established technology in special PCB manufacturing and has already been investigated. 40 Independent of TEG manufacturing some work has also addressed laser structuring of electronic thick films on LTCC substrates in general 41 or for applications, such as to generate microwave circuits 42 or microstructured low-pass filter. 43 An adaptation of LTCC technology and laser processing to TEG manufacturing has significant potential for several reasons.…”

Section: Processing Of Tegsmentioning

confidence: 99%

“…The parameters are based on the findings from preliminary work 47,48 and other studies on laser processing of LTCC. [40][41][42][43][54][55][56] In particular, when CO 2 lasers are used, a high amount of thermal energy is dissipated into the surrounding areas of the LTCC substrate due to the large wavelength and long pulse durations. 40 When cutting the LTCC substrate, the binder matrix is thermally removed and ceramic particles are deposited.…”

Section: Processingmentioning

confidence: 99%

“…Second, the substrate is flexible at the beginning and can tolerate a thermal post‐processing with temperatures above 1000 K in comparison to polymer substrates. Third, as demonstrated by Gutzeit et al, very small structures of up to 25 μm widths can be theoretically realized by laser structuring with suitable equipment, 41 which is comparable to or smaller than the resolution of practically available screen‐printing processes (˜ 100 μm 44 ).…”

Section: Introductionmentioning

confidence: 98%

“…For example, the Ni‐based systems presented by Jaziri et al have high requirements for the equipment due to their toxicity in a spray process. In addition, thermal post‐processing of CCO, Ag, and LTCC substrate can be realized in the single common processing step due to overlapping sintering ranges 41 …”

Section: Introductionmentioning

confidence: 99%

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Experimental application of a laser‐based manufacturing process to develop a free customizable, scalable thermoelectric generator demonstrated on a hot shaft

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Geometry, design, and processing in addition to the thermoelectric material properties have a significant influence on the economic efficiency and performance of thermoelectric generators (TEGs). While conventional BULK TEGs are elaborate to manufacture and allow only limited variations in geometry, printed TEGs are often restricted in their application and processing temperature due to the use of organic materials. In this work, a proof‐of‐concept for fabricating modular, customizable, and temperature‐stable TEGs is demonstrated by applying an alternative laser process. For this purpose, low temperature cofired ceramics substrates were coated over a large area, freely structured and cut without masks by a laser and sintered to a solid structure in a single optimized thermal post‐processing. A scalable design with complex geometry and large cooling surface for application on a hot shaft was realized to prove feasibility. Investigations on sintering characteristics up to a peak temperature of 1173 K, thermoelectric material properties and temperature distribution were carried out for a Ca3Co4O9/Ag‐based prototype and evaluated using profilometer, XRD, and IR measurements. For a combined post‐processing, an optimal sintering profile could be determined at 1073 K peak temperature with a 20 min holding time. Temperature gradients of up to 100 K could be achieved along a thermocouple. A single TEG module consisting of 12 thermocouples achieved a maximum power of 0.224 μW and open‐circuit voltage of 134.41 mV at an average hot‐side temperature of 413.6 K and temperature difference of 106.7 K. Three of these modules combined into a common TEG with a total of 36 thermocouples reached a maximum power of 0.58 K and open‐circuit voltage of 319.28 mV with a lesser average hot‐side temperature of 387.8 K and temperature difference of 83.4 K.

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Section: Methodsmentioning

confidence: 99%

Section: Processing Of Tegsmentioning

confidence: 99%

Section: Processingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Experimental application of a laser‐based manufacturing process to develop a free customizable, scalable thermoelectric generator demonstrated on a hot shaft

Abt

Kruppa

Wolf

et al. 2022

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View full text Add to dashboard Cite

show abstract

High‐resolution patterning on LTCC by transfer of photolithography‐based metallic microstructures

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Fritz

et al. 2023

Int J Applied Ceramic Tech

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The growing applications and constant miniaturization of electronic devices and of low‐temperature co‐fired ceramics (LTCC) in various fields, such as aviation, telecommunications, automotive, satellite communications, and military, have led to an increase in the demand for LTCC. Such prospects arise due to the continuous scaling down of components and high‐density interconnection in electronics packaging. This paper reports a technique for the transfer of high‐resolution microstructures from silicon substrates to LTCC. In this method, gold and copper patterns were formed by photolithography, electrodeposition, and residual layer stripping on silicon substrate. Lithography provides the opportunity to create and transfer complex patterns for use in several different applications and electroplating enables the use of pure metal for excellent electrical properties. The developed structures were transferred onto a top layer of LTCC tape using hot embossing. Then, the subsequent layers were stacked, laminated, and sintered. A resolution of 1.5 μm after free sintering and 4.5 μm after pressure‐assisted sintering was achieved. This distinctive method can be useful for several applications requiring high‐resolution and superior electrical properties.

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Picosecond Laser Structuring Technology for LTCC - the Improvement of Fine Line Structuring

Cited by 2 publications

References 9 publications

Experimental application of a laser‐based manufacturing process to develop a free customizable, scalable thermoelectric generator demonstrated on a hot shaft

Experimental application of a laser‐based manufacturing process to develop a free customizable, scalable thermoelectric generator demonstrated on a hot shaft

High‐resolution patterning on LTCC by transfer of photolithography‐based metallic microstructures

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