Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Abstract

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological considerations based on some unusual observations highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.

Reliability assessment of an autonomous underwater vehicle propulsion by using electrical multi-phase drive

“…The lifetime prediction of a SC commonly uses model as in [12] - [16] which depends on junction cycling temperature ΔT j . To obtain the SC failure rate without cycling, the FIDES guide 2009 [17] is used.…”

“…In this way, the sinusoidal MMF is conserved but its magnitude is mitigated. Accordingly, it is necessary to assess the torque T pu in each reconfiguration by (16).…”

A Temperature Gradient-Based Potential Defects Identification Method for IGBT Module

“…Consequently, many researches are concentrated on the calculation, measurement and application of thermal behavior in power modules condition evaluation, reliability design [8][9][10]. Selection of the approach to reliability design and condition monitoring for electronic products has been an evolutionary process [9].…”

“…Selection of the approach to reliability design and condition monitoring for electronic products has been an evolutionary process [9]. At present, nondestructive testing techniques are reported in use such as scanning acoustic tomography [11] and active thermography [12].Some thermal or electrical parameters are also adopted to monitor the degradation of power modules, and this method mainly concentrates on the surface response [13], or the transient electric parameters which are internal-failure-sensitive parameters [14][15][16][17][18].…”

Design for Reliability of Power Electronics for Grid-Connected Photovoltaic Systems

“…Hence, a transition to the Physics-of-Failure (PoF) based reliability analysis is undergoing [25], [26], [30], [33], [53], where identifying the root-causes of failures in power electronics is one of the attempts. In addition, for the PoF reliability analysis, different failure mechanisms from the points of view of physical structure, internal material characteristic, and operational environment/condition in power electronics are studied in prior-art research [35], [53]- [66].…”