Microelectronic Materials and Processes 1989
DOI: 10.1007/978-94-009-0917-5_4
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Physical Vapor Deposition

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Cited by 31 publications
(3 citation statements)
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“…Physical Vapor Deposition of Metals on TMC Surfaces. The deposition of Pt, Au, Ag, or Cu on the prepared TMC thin films was conducted by a physical vapor deposition (PVD) method 28 in ultrahigh vacuum (UHV) conditions by resistively heating tungsten filaments wrapped with 99.99% pure metal wires of the desired metal. Before PVD was conducted, TMC foils were dipped in 0.3 M NaOH for 15 min to remove passivated oxide layers.…”
Section: Experimental and Theoretical Methodsmentioning
confidence: 99%
“…Physical Vapor Deposition of Metals on TMC Surfaces. The deposition of Pt, Au, Ag, or Cu on the prepared TMC thin films was conducted by a physical vapor deposition (PVD) method 28 in ultrahigh vacuum (UHV) conditions by resistively heating tungsten filaments wrapped with 99.99% pure metal wires of the desired metal. Before PVD was conducted, TMC foils were dipped in 0.3 M NaOH for 15 min to remove passivated oxide layers.…”
Section: Experimental and Theoretical Methodsmentioning
confidence: 99%
“…(17)(18)(19)(20)(21)(22) In the simplest form, depicted in Fig. 2a, sputtering is obtained by generating a beam of inert-gas ions, accelerating the beam to energies of a few kV, and directing the beam at a target composed of the material to be deposited.…”
Section: Sputter Depositionmentioning
confidence: 99%
“…P HYSICAL vapor deposition (PVD) is a widely used method for thin film growth in which material is vaporized from a source, transported as a vapor, and condensed onto a target [1]- [3]. It is used in a wide range of applications including coatings [4], diffusion barriers [5], micro/nanoelectronics [6], [7], magnetic films for data storage [8]- [10], synthesis of 2D materials [11], [12], synthesis of quench condensed superconductors [13]- [16], and synthesis of nano/micro patterned metal structures [17]- [20]. Generally, these systems are large, expensive, and slow to start and stop deposition.…”
Section: Introductionmentioning
confidence: 99%