Proceedings of 2011 International Symposium on VLSI Technology, Systems and Applications 2011
DOI: 10.1109/vtsa.2011.5872253
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Physical mechanism of HfO<inf>2</inf>-based bipolar resistive random access memory

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Cited by 12 publications
(5 citation statements)
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“…In this paper, a different model for the resistive switching in TiN/Ti/HfO 2 /TiN devices without thermal annealing is presented. Our model is compatible with theoretical findings, similar to switching models presented by other groups and able to explain experimentally obtained data. ,,, Furthermore, the conditions for filament growth from the anode to the cathode are discussed. 2D and 3D models have different advantages.…”
Section: Introductionsupporting
confidence: 91%
“…In this paper, a different model for the resistive switching in TiN/Ti/HfO 2 /TiN devices without thermal annealing is presented. Our model is compatible with theoretical findings, similar to switching models presented by other groups and able to explain experimentally obtained data. ,,, Furthermore, the conditions for filament growth from the anode to the cathode are discussed. 2D and 3D models have different advantages.…”
Section: Introductionsupporting
confidence: 91%
“…As suggested by the experimental data [14], the LRS resistance shows a strong dependence on current. Since the set transition involves a continuous growth of conductive filaments, higher current results in lower final set state resistance.…”
Section: ) Lrs Calculationmentioning
confidence: 54%
“…In the oxide-based RRAM, oxygen vacancies play a crucial role in the resistance switching, but, on the other hand, they also cause undesired resistance fluctuation of RRAM. The positively charged oxygen vacancies are mobile under high field and serve like donor dopants to make RRAM n-type semiconductor [14]. Accordingly, we neglect the impact of holes and only consider the electron drift as the conduction current.…”
Section: A Current Calculation Modulementioning
confidence: 99%
“…Causes for these errors include diffusion of oxygen vacancies (leading to state drift) [6], ion strikes [7], [8], and environmental factors [9]. These soft errors can accumulate over time [6], [7], [15] or occur abruptly [8], [9].…”
Section: B Soft Errors In Memristorsmentioning
confidence: 99%