Fifth Asia-Pacific Conference on ... And Fourth Optoelectronics and Communications Conference on Communications, 1999 Help me understand this report
Photonics intensive packaging system using a new flexible fiber wiring board with "apertures"
Abstract: We have proposed and demonstrated a new photonics intensive packaging system and related board configuration using a fiber wiring board with "apertures" for interconnecting multichip modules having massively parallel optical VO.
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2002
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