Photonic Packaging Sourcebook

Fischer-Hirchert, Ulrich H. P.

doi:10.1007/978-3-642-25376-8

Cited by 14 publications

(5 citation statements)

References 0 publications

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“…The proposed method can be used to perform distance measurements, thus creating a generic proximity sensor. Systems currently used for optical distance measurement by means of LED emitters, called LED Reflective Distance Sensors (LED-RDS), are constituted by a LED and a photodetector placed side by side [37,38]. LED-RDS are mass produced and used mainly in barcodes scanners or encoders.…”

Section: Distance Measurement Operation Modementioning

confidence: 99%

Applications of light emitting diodes as sensors of their own emitted light

Vannacci¹,

Granchi²,

Calzolai³

et al. 2019

Opto-Electronics Review

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In literature, it is known that a Light Emitting Diode (LED) could be used as a light sensor. It is also known that its emitted light spectrum and sensitivity spectrum can be partially overlapped. This work presents how commercial LEDs can be used as light emitters and simultaneously as sensors of the reflected portion of the light emitted by themselves. The realized devices present a unique characteristic: the transmitter and the receiver coincide spatially as they are the same device. This ensures the perfect overlapping between transmission and reception radiation lobes that could provide many benefits in several applications like as distance measurements or image sensors. Some simple electronic configurations that use LEDs as detectors of their own emitted light are presented. It has been also demonstrated how these LEDs Tx-Rx can work as image sensors by acquiring an image of a simple test object, and how they can realize distance sensors with respect to other known techniques. Further advantages can be obtained by realizing LED Tx-Rx array in single integrated devices. With the realization of such devices, it will be also possible to experiment new constructive solutions for commonly used applications, without the need of using separate emitter and receiver.

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Section: Distance Measurement Operation Modementioning

confidence: 99%

Applications of light emitting diodes as sensors of their own emitted light

Vannacci¹,

Granchi²,

Calzolai³

et al. 2019

Opto-Electronics Review

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“…Отметим, что в Zemax® была добавлена модель стандартного металлостеклянного корпуса ТО-46, выполненная в системе автоматизированного проектирования по спецификации 3 . Часть корпуса, созданная из кевлара, задана как полностью поглощающая, при этом входное окно -сапфир, показатель преломления которого равен 1,7462 [27].…”

Section: описание элементов оптической системы фотоприемного модуляunclassified

“…Для обеспечения защиты приборные структуры размещают в корпусах, среди которых самые распространенные -корпуса типа ТО и «Butterfly» [1,2]. При этом во время разработки фотоприемных модулей важным вопросом является обеспечение оптической стыковки ОВ (оптического волокна) с входным окном фотоприемника: от ее качества будет зависеть итоговая спектральная фоточувствительность модуля [3].…”

Section: Introductionunclassified

Optimization of the optical scheme of a photodetector module operating in the spectral range of 1.3-1.6 μm

Kovach¹,

Andryushkin²,

Kolodeznyi³

et al. 2022

Naučno-teh. vestn. inf. tehnol. meh. opt.

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Optical system consisting of single-mode optical fiber and p-i-n photodiode semiconductor chip with InGaAs active layer was investigated. Considered photodetector module has responsivity in 1.3-1.6 µm. The problem of optical power loss due to inaccurate matching between the optical fiber and the active medium of photodiode in photodetector modules is investigated; resolving the power loss problem will lead to an increase in the spectral photosensitivity and external quantum efficiency of the photodetector module. Optimization of optical fiber coupling with semiconductor chip was implemented in Zemax® software with built-in Levenberg-Marquardt algorithm. Also, numerical calculations of the influence of the transverse and longitudinal displacement on optical coupling efficiency in the photodetector module were carried out. The optical system of photodetector module based on standard metal can package was built in Zemax® software. Optimal distances between elements of the photodetector module were calculated, and maximum efficiency of 93.1 % optical coupling between single-mode fiber and photodiode aperture was achieved. The necessary sensitivity of linear micro translators used during the assembly of photodetector modules was determined to ensure the alignment of optical elements with coupling efficiency more than 90 %. The results of this work can be used in the design of photodetector modules. The proposed solutions can be relatively easily modified to create photodetector modules of other spectral ranges.

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“…Photonic packaging technology has achieved a higher significance under optical communication systems' recent developments [82] by covering the optical and electronic connections in/out of the PIC. Packaging process developments are of great importance for the next generation of optical components [6].…”

Section: Integrated Photonics Packagingmentioning

confidence: 99%

Photonic Integrated Circuits for NGPON2 ONU Transceivers (Invited)

et al. 2020

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The development of photonic integrated circuits (PIC) for access network applications, such as passive optical networks (PON), constitutes a very attractive ecosystem due to PON’s potential mass market. The implementation of PIC solutions in this context is expected to facilitate the possibility of increasing the complexity and functionalities of devices at a potentially lower cost. We present a review addressing the prominent access network market requirements and the main restrictions stemming from its specific field of application. Higher focus is given to PON devices for the optical network unit (ONU) and the implications of designing a device ready for market by discussing its various perspectives in terms of technology and cost. The discussed PIC solutions/approaches in this paper are mainly based on indium phosphide (InP) technology, due to its monolithic integration capabilities. A comprehensive set of guidelines considering the current technology limitations, benefits, and processes are presented. Additionally, key current approaches and efforts are analyzed for PON next generations, such as next-generation PON 2 (NGPON2) and high-speed PON (HSP).

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Photonic Packaging Sourcebook

Cited by 14 publications

References 0 publications

Applications of light emitting diodes as sensors of their own emitted light

Applications of light emitting diodes as sensors of their own emitted light

Optimization of the optical scheme of a photodetector module operating in the spectral range of 1.3-1.6 μm

Photonic Integrated Circuits for NGPON2 ONU Transceivers (Invited)

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