Abstract:Erbium (Er) ions were implanted into 4H and 6H silicon carbide (SiC). The temperature-dependent photoluminescence (PL) and PL lifetime were characterized. The optimum annealing temperature for SiC : Er were 1600 °C. PL intensity decreased at 1700 'C, and the bandedge luminescence changed in relation to the luminescence of Er 3 ÷. Thermal quenching of the luminescence of Er3+ was suppressed by using SiC with a wide band gap as a host material. The Er9+ -PL was observed at room temperature (RT). We monitored the… Show more
“…Suspended SiC structures fabricated on standard SiC on Si substrates are compatible with high temperature thermal annealing [41,42]. These are useful for increasing the crystal purity for lowered scattering or absorption losses from imperfect material growth, oxidation-smoothing of sidewalls with oxygen annealing or implantation of ions such as vanadium or rare earths [43].…”
We fabricate suspended single-mode optical waveguides and ring resonators in 3C silicon carbide (SiC) that operate at telecommunication wavelength, and leverage post-fabrication thermal annealing to minimize optical propagation losses. Annealed optical resonators yield quality factors of over 41,000, which corresponds to a propagation loss of 7 dB/cm, and is a significant improvement over the 24 dB/cm in the case of the non-annealed chip. This improvement is attributed to the enhancement of SiC crystallinity and a significant reduction of waveguide surface roughness, from 2.4 nm to below 1.7 nm. The latter is attributed to surface layer oxide growth during the annealing step. We confirm that the thermo-optic coefficient, an important parameter governing high-power and temperature-dependent performance of SiC, does not vary with annealing and is comparable to that of bulk SiC. Our annealing-based approach, which is especially suitable for suspended structures, offers a straightforward way to realize high-performance 3C-SiC integrated circuits.
“…Suspended SiC structures fabricated on standard SiC on Si substrates are compatible with high temperature thermal annealing [41,42]. These are useful for increasing the crystal purity for lowered scattering or absorption losses from imperfect material growth, oxidation-smoothing of sidewalls with oxygen annealing or implantation of ions such as vanadium or rare earths [43].…”
We fabricate suspended single-mode optical waveguides and ring resonators in 3C silicon carbide (SiC) that operate at telecommunication wavelength, and leverage post-fabrication thermal annealing to minimize optical propagation losses. Annealed optical resonators yield quality factors of over 41,000, which corresponds to a propagation loss of 7 dB/cm, and is a significant improvement over the 24 dB/cm in the case of the non-annealed chip. This improvement is attributed to the enhancement of SiC crystallinity and a significant reduction of waveguide surface roughness, from 2.4 nm to below 1.7 nm. The latter is attributed to surface layer oxide growth during the annealing step. We confirm that the thermo-optic coefficient, an important parameter governing high-power and temperature-dependent performance of SiC, does not vary with annealing and is comparable to that of bulk SiC. Our annealing-based approach, which is especially suitable for suspended structures, offers a straightforward way to realize high-performance 3C-SiC integrated circuits.
“…Suspended SiC structures fabricated on standard SiC on Si substrates are compatible with high temperature thermal annealing due to the absence of intermediate layers, as the thermal expansion coefficient of SiC and Si are of the same order in magnitude [8]. This is useful for increasing the crystal purity for lowered scattering or absorption losses from imperfect material growth, oxidation-smoothing of sidewalls with oxygen annealing or implantation of ions such as vanadium or rare earths [9] which are useful for creating optically active emitters or doped optical amplifiers.…”
We fabricate suspended single-mode optical waveguides and ring resonators in 3C-SiC that operate at telecommunication wavelength, leverage post-fabrication thermal annealing to minimize optical propagation losses and demonstrate Q of over 41,000.
Erbium (Er) ions were implanted into 4H and 6H silicon carbide (SiC). The temperature-dependent photoluminescence (PL) and PL lifetime were characterized. The optimum annealing temperature for SiC : Er were 1600 °C. PL intensity decreased at 1700 'C, and the bandedge luminescence changed in relation to the luminescence of Er 3 ÷. Thermal quenching of the luminescence of Er3+ was suppressed by using SiC with a wide band gap as a host material. The Er9+ -PL was observed at room temperature (RT). We monitored the auger effect that is believed to be the main cause of the thermal quenching process and concluded that, in the temperature range 15 K to 70 K, the thermal quenching process has a close relation to nonradiative recombination from the first excited state (411/2) to the ground state (41j5O of Er 3 +.
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