Ruthenium
(Ru) has drawn attention in the field of future semiconductor
processing as a diffusion barrier layer and an electrode material.
Here, ruthenium films are deposited by atomic layer deposition (ALD)
using a novel precursor, Ru2{μ2-η3-N(tBu)–C(H)–C(iPr)}(CO)6 (T-Rudic), and two different co-reagents, that
is, H2O and O2. Ru films are deposited at 0.1
Å/cycle at 150 °C with H2O and 0.8 Å/cycle
at 200 °C with O2. The H2O reactant set
exhibits ALD saturation between 150 and 200 °C. However, the
O2 reactant set shows a linear incremental growth rate
over 200 °C and nongrowth under 175 °C. Film growth preference
is observed on various substrates (e.g., Si, SiO2, Al2O3, and graphitic carbon) when the H2O reactant is applied at 150 °C. Both experimental data and
density functional theory calculations indicate that preferential
growth occurs on a hydrogen-terminated surface (Si) rather than a
hydroxyl-terminated surface (SiO2). The Auger electron
spectroscopy mapping image of a selectively deposited Ru film on a
patterned Si and SiO2 substrate supports that this selective
deposition mechanism also occurs in a square-patterned substrate.