Although intense efforts have been devoted to the development
of
thermally conductive epoxy resin composites, most previous works ignore
the importance of the contact thermal resistance between epoxy resin
composites and mating surfaces. Here, we report on epoxy resin/hexagonal
boron nitride (h-BN) composites, which show low contact thermal resistance
with the contacting surface by tuning adhesion energy. We found that
adhesion energy increases with increasing the ratio of soybean-based
epoxy resin/amino silicone oil and h-BN contents. The adhesion energy
has a negative correlation with the contact thermal resistance; that
is, enhancing the adhesion energy will lead to reduced contact thermal
resistance. The contact thermal conductance increases with the h-BN
contents and is low to 0.025 mm2·K/W for the epoxy
resin/60 wt % h-BN composites, which is consistent with the theoretically
calculated value. By investigating the wettability and chain dynamics
of the epoxy resin/h-BN composites, we confirm that the low contact
thermal resistance stems from the increased intermolecular interaction
between the epoxy resin chains. The present study provides a practical
approach for the development of epoxy resin composites with enhanced
thermal conductivity and reduced contact thermal resistance, aiming
for effective thermal management of electronics.