Abstract:Although intense efforts have been devoted to the development
of
thermally conductive epoxy resin composites, most previous works ignore
the importance of the contact thermal resistance between epoxy resin
composites and mating surfaces. Here, we report on epoxy resin/hexagonal
boron nitride (h-BN) composites, which show low contact thermal resistance
with the contacting surface by tuning adhesion energy. We found that
adhesion energy increases with increasing the ratio of soybean-based
epoxy resin/amino silic… Show more
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