2009
DOI: 10.1016/j.tsf.2008.09.046
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Phase separated AlSi thin films prepared by filtered cathodic arc deposition

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Cited by 7 publications
(4 citation statements)
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“…EDS measurements (figure 1(d)) confirm a close to uniform distribution of Al over the film thickness, as well as the 50:50 ratio between Si and Al in the film stoichiometry. These observations are consistent with those reported previously [18,20] and demonstrate reproducibility and robustness of the growth method.…”
Section: Resultssupporting
confidence: 93%
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“…EDS measurements (figure 1(d)) confirm a close to uniform distribution of Al over the film thickness, as well as the 50:50 ratio between Si and Al in the film stoichiometry. These observations are consistent with those reported previously [18,20] and demonstrate reproducibility and robustness of the growth method.…”
Section: Resultssupporting
confidence: 93%
“…The Al wires grow perpendicularly to the substrate surface and stretch over the film thickness. Previous reports have demonstrated the fabrication of such structures by magnetron sputtering and filtered cathodic vacuum arc deposition [18,20]. 3 Author to whom any correspondence should be addressed.…”
Section: Introductionmentioning
confidence: 99%
“…The porous a-Si material can be formed through anodization of a-Si [15,16], which generally yields a branched arrangement of random size pores. On the other hand, much finer and denser porosity on a nanoscale can be realized in co-sputtered a-Si:Al material system via a two-step process that involves Al and Si phase separation and subsequent selective etching of Al [17,18,19]. This method exploits the fact that at certain growth conditions the low solid-solubility of Al in Si leads to the self-assembled formation of Al NWs, yielding a densely packed network of vertically aligned NWs (with typical diameter and separation pitch of ~5 nm) embedded in the a-Si matrix.…”
Section: Introductionmentioning
confidence: 99%
“…There are several techniques for the deposition of thin films: evaporation [4], chemical vapor deposition (CVD) [5], pulsed laser deposition (PLD) [6][7][8], sol-gel [9], spray pyrolysis [10][11][12], sputtering [13][14][15], and filtered cathodic arc deposition (FCAD) [16][17][18][19][20][21], among others. The main advantages of the FCAD process are: high deposition rate and control of ion energies, which allow for higher adhesion of the film to the substrate, good density, low processing temperature of the substrate, and good compatibility in hybrid processes; these advantages permit a selective deposition of ions [22].…”
Section: Introductionmentioning
confidence: 99%