Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems

Studnitzky, Thomas; Schmid–Fetzer, Rainer

doi:10.1007/s11664-003-0239-3

Cited by 22 publications

(16 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…3 with significant solid solubility, a low melting filler material and no intermetallic phases occurring at the bonding temperature. No intermetallic phases are formed in the bond during the diffusion brazing process in contrast to soldering or diffusion soldering [15][16][17] which is ruled by different phase diagrams.…”

Section: Phase Diagram Applications Exemplified With Cu-nimentioning

confidence: 98%

Phase Diagrams: The Beginning of Wisdom

Schmid–Fetzer

2014

J. Phase Equilib. Diffus.

Self Cite

View full text Add to dashboard Cite

This work presents a primer on ''How to Read and Apply Phase Diagrams'' in the current environment of powerful thermodynamic software packages. Advanced aspects in that context are also covered. It is a brief guide into using this cornerstone of knowledge in materials science and engineering and offers assistance in the proper interpretation of results obtained from stateof-the-art Calphad-type thermodynamic calculations. Starting from the very basics it explains the reading of unary, binary and ternary phase diagrams, including liquidus projections, isothermal and vertical phase diagram sections. Application examples are directly derived from these phase diagrams of Fe, Cu-Ni, Mg-Al, and Mg-Al-Zn. The use of stable and metastable phase diagrams and appropriate choices of state variables are explained for the relevant Fe-C and Fe-C-Si systems. The most useful concept of zero-phase fraction lines in phase diagram sections of multicomponent systems is made clear by coming back to the Cu-Ni and Mg-Al-Zn systems. Thermodynamic solidification simulation using the Scheil approximation in comparison to the equilibrium case is covered in context of multicomponent multiphase solidification and exemplified for Mg-Al-Zn alloys. The generic approach is directly applicable for all inorganic materials, but exemplified in this concise work for a small selection of metallic systems to highlight the interdependences among the phase diagrams. The embedded application examples for real material systems and various materials processes also emphasize the use of phase diagrams for the path from initial off-equilibrium state towards equilibrium.

show abstract

Section: Phase Diagram Applications Exemplified With Cu-nimentioning

confidence: 98%

Phase Diagrams: The Beginning of Wisdom

Schmid–Fetzer

2014

J. Phase Equilib. Diffus.

Self Cite

View full text Add to dashboard Cite

show abstract

“…For the base metal, it is majorly focused on the Cu, Ag and Au series [9,[11][12][13][14][15][16][17][18][19], while researches on Ni, Pd and Pt have been also reported in recent years [20,21]. The primary criterion for selection of an interlayer is melting point and compatibility with base metal such as high solubility and high diffusivity.…”

Section: Introductionmentioning

confidence: 99%

“…In general, LTTLP bonding process is often conducted at temperatures higher than melting point of the interlayer by a range of 15-120°C, and bonding time mainly depends on the thickness of the interlayer [9,[15][16][17][18][19]. Most of studies concentrated on microstructure evolution [9,21,23], interfacial reaction [12,13,21], kinetics of the IMCs growth [12,13], thermal reliability [24,25], and electrical or mechanical behaviors of the joints [9,11,23] for above systems applied in electronic packaging and interconnects.…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding

Shao

Bao

et al. 2016

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Low temperature transient liquid phase (LTTLP) bonding is a promising technology to enable in high temperature electronic packaging. In this study, interfacial reaction and mechanical characterizations for Cu/Sn/ Ag system LTTLP bonding at temperatures ranging from 260 to 340°C for various time were investigated. Experimental results showed that Cu and Ag substrate independently reacted with molten Sn, and the growth of IMCs on one side was hindered by the opposite IMCs layer after scalloped Cu 6 Sn 5 contacted with the Ag 3 Sn, and there was no ternary alloy phase formed all the time. Pores were found and distributed at the Cu 6 Sn 5 /Ag 3 Sn interface or between grain boundaries after the residual Sn was fully consumed, however, they gradually disappeared with continuing reaction of that Cu 6 Sn 5 phase converted into Cu 3 Sn phase. Shear strength of the LTTLP joints increased with increasing bonding time, and the adhesive strength of Cu 6 Sn 5 /Ag 3 Sn interface was weaker than that of the Cu 3 Sn/Ag 3 Sn interface. The rupture behaviors were also discussed with a fracture model. As follow, cracks initiated in the pore and mainly propagated along the Cu

show abstract

“…[14][15][16] When acceptable bonding temperatures and times are used, the TLP joints produced generally consist of intermetallic compounds (IMCs) of the base metals and the Sn, In, InSn, SnBi, BiIn 2 , or SnInBi interlayer. Although the IMCs are more brittle than the corresponding base metals, they have much higher mechanical strength and creep resistance than the conventional Sn-based solders used in electronic packaging and interconnects.…”

Section: Introductionmentioning

confidence: 99%

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

Agyakwa

Johnson

2014

Journal of Elec Materi

View full text Add to dashboard Cite

Real Si insulated gate bipolar transistors with conventional Ni/Ag metallization and dummy Si chips with thickened Ni/Ag metallization have both been bonded, at 250°C for 0 min, 40 min, and 640 min, to Ag foil electroplated with 2.7 lm and 6.8 lm thick Sn as an interlayer. On the basis of characterization of the microstructure of the resulting joints, suitable thicknesses are suggested for the Ag base metal and the Sn interlayer for Ag/Sn/Ag transient liquid-phase (TLP) joints used for power die attachment. The diffusivities of Ag and Sn in the nAg phase were also obtained. In combination with the kinetic constants of Ag 3 Sn growth and diffusivities of Ag and Sn in Ag reported in the literature, the diffusivities of Ag and Sn in the nAg phase were also used to simulate and predict diffusion-controlled growth and evolution of the phases in Ag/Sn/Ag TLP joints during extended bonding and in service.

show abstract

Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems

Cited by 22 publications

References 22 publications

Phase Diagrams: The Beginning of Wisdom

Phase Diagrams: The Beginning of Wisdom

Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

Contact Info

Product

Resources

About