Perspective—Demystifying the Power Withstanding Capabilities of CNT Bundle Interconnects

Abstract

This article discusses power consumption trends of two geometries of carbon nanotube (CNT) bundle interconnects for very large scale integration applications. Electrostatic and electrothermal field simulations of square and triangular CNT bundle interconnects were done. Two factors viz. power dissipated and peak temperature are extracted and a new figure of merit called power temperature product (PTP) is defined. The PTP is calculated for interconnect lengths ranging from 500 to 2000µm. Results show that both triangular and square CNT bundles have high power withstanding capacity. Triangular CNT bundles have higher PTP when the associate phase changes are ignored.

A Comparative Study and Analysis of Various Interconnects for Very Large-Scale Integration

“…Power temperature product (PTP) is defined in a research by Femi Robert et al 2 that discusses the carbon nano tube bundle interconnects' ability to withstand power. For interconnect lengths ranging from 500 m to 2000 m, the PTP is determined.…”