Performance of a compact beamline with high brightness for x-ray lithography

The image-forming limit of x-ray lithography is said to be ∼70 nm using existing devices and technologies. This article presents methods to extend the limit to 25 nm or even below. Preparatory to the study, a light source was designed to improve x-ray beam toward shorter wavelength. In addition, a simulation code has been developed to evaluate the methods. The first method is to use a mask with a larger period and pattern than deigned images. The mask forms the designed images with an enlarged period. Two-dimensional, 25 nm width images can be formed using a 100 nm period pattern mask at 8 μm gap. The second method is to use a mask with interference slits. Since the image pattern is sharply focused, ⩽25 nm images can be formed at 8–12 μm gaps. Multiple exposures are applied to both methods in order to fill in the clearances of the images. Simulation results are shown in both methods for typical patterns.

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“…7 In Fig. SHI's Aurora-2 3,4 and its beamline 5,6 have demonstrated the performance as the hardest spectrum presently used.…”

Section: A Improvement Of Beam Qualitymentioning

confidence: 98%

Technique for 25 nm x-ray nanolithography

Toyota

Hori

Khan³

et al. 2001

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…Several compact beamlines (e.g., BL11 and BL13) less than 5 m long for micro-fabrication already developed were adopted to carry out the X-ray deep lithography. Detailed descriptions for BL11 have been written elsewhere (Hirose 2000). The BL13 consists of (a) a front end connected to the SR source, an ultrahigh vacuum part (base pressure of 2 9 10 -9 Torr), (b) an intermediate part with some filters (50 lm of beryllium, 100 9 10 mm 2 ), also an ultrahigh vacuum part, and (c) an exposure chamber separated by a beryllium window (300 lm, 100 9 10 mm 2 ).…”

Section: Fabrication Of Liga Mold Insertsmentioning

confidence: 99%

Micro injection molding for mass production using LIGA mold inserts

et al. 2008

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Micro molding is one of key technologies for mass production of polymer micro parts and structures with high aspect ratios. The authors developed a commercially available micro injection molding technology for high aspect ratio microstructures (HARMs) with LIGA-made mold inserts and pressurized CO 2 gasses. The test inserts made of nickel with the smallest surface details of 5 lm with structural height of 15 lm were fabricated by using LIGA technology. High surface quality in terms of low surface roughness of the mold inserts allowed using for injection molding. Compared to standard inserts no draft, which is required to provide a proper demolding, was formed in the inserts. To meet higher economic efficiency and cost reduction, a fully electrical injection molding machine of higher accuracy has been applied with dissolving CO 2 gasses into molten resin. The gasses acts as plasticizer and improves the flowability of the resin. Simultaneously, pressurizing the cavity with the gasses allows high replication to be obtained. Micro injection molding, using polycarbonate as polymer resins, with the aspect ratio of two was achieved in the area of 28 9 55 mm 2 at the cycle time of 40 s with CO 2 gasses, in contrast to the case of the aspect ratio of 0.1 without the gasses.

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“…Recently, we achieved an exposure dose intensity of 43 mW/cm 2 on a wafer at 500 mW beam current, the dose uniformity of Ϯ2.8% within a 26ϫ26 mm 2 exposure area using our original short beamline. 4,5 The critical wavelength of 1.4 nm characterizes A2S as a soft x-ray source. The majority of the SR beam at the end of the beamline lies around 1.5 keV ͑0.8 nm͒.…”

Section: A Compact Sr Light Sourcementioning

confidence: 99%

Compact synchrotron radiation lithography system for 70 nm device manufacturing

Miyatake

Hirose

et al. 2001

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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We report on the performance and reliability of our synchrotron radiation (SR) based x-ray lithography (XRL) system installed in Tanashi Works of Sumitomo Heavy Industries, Ltd. Our XRL facilities include a compact racetrack-type SR light source “AURORA-2S” (A2S), the injector microtron, a 3-m-long beamline, and the second version x-ray aligner. In 2000, A2S proved the beam lifetime of 16 h in regular operation at the designed beam current 500 mA. The XRL beamline offers a high-dose exposure rate of over 43 mW/cm2 on a wafer at beam current 500 mA. The x-ray aligner achieved an overlay accuracy better than 16 nm (3σ) using a video-based scattered-light alignment (SLA) system. In the SLA, edge scattering on matrix array patterns provides multispot video images for mask to wafer alignment. A 70 nm line and space (L/S) pattern was replicated with a gap of 15 μm. In resolution enhancement exposure, we replicated a 100 nm L/S and 1 100 nm hole pattern using a 200 nm L/S and a 200 nm hole pattern of x-ray mask, respectively.

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Performance of a compact beamline with high brightness for x-ray lithography

Cited by 6 publications

References 9 publications

Technique for 25 nm x-ray nanolithography

Technique for 25 nm x-ray nanolithography

Micro injection molding for mass production using LIGA mold inserts

Compact synchrotron radiation lithography system for 70 nm device manufacturing

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