2023 IEEE Devices for Integrated Circuit (DevIC) 2023
DOI: 10.1109/devic57758.2023.10134996
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Performance Investigation of Inverted T-shaped Heterojunction FinFET along with Oxide Stacking.

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“…Different studies have been carried out in the literature to obtain better results by applying various ideas on the device structures such as high K dielectric materials [20][21][22], different semiconductor materials [23][24][25][26], high K spacers [27][28][29], mobility enhancement using strain technology [30][31][32][33]. Moreover, multi-gate junctionless transistors to improve gate control have also been studied [12,27,[34][35][36][37][38][39][40][41]. The study on the performance of device structures after the insertion of the dielectric pockets, ferroelectric as the gate material, thin gate dielectric, source and drain extension [42] etc has been presented in the literature.…”
Section: Image Sensorsmentioning
confidence: 99%
“…Different studies have been carried out in the literature to obtain better results by applying various ideas on the device structures such as high K dielectric materials [20][21][22], different semiconductor materials [23][24][25][26], high K spacers [27][28][29], mobility enhancement using strain technology [30][31][32][33]. Moreover, multi-gate junctionless transistors to improve gate control have also been studied [12,27,[34][35][36][37][38][39][40][41]. The study on the performance of device structures after the insertion of the dielectric pockets, ferroelectric as the gate material, thin gate dielectric, source and drain extension [42] etc has been presented in the literature.…”
Section: Image Sensorsmentioning
confidence: 99%