2020
DOI: 10.1016/j.diamond.2020.107976
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Performance evaluation of carbon nanoparticle-based thermal interface materials

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Cited by 7 publications
(3 citation statements)
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“…With the continuous upgrading of electronic devices, their densification and integration trend will inevitably lead to the release of a large amount of heat during work, resulting in local high temperatures and even damaging electronic components [1]. According to research, under certain conditions, the reliability of electronic components will decrease by 5% when the temperature increases by 1 °C [2].…”
Section: Introductionmentioning
confidence: 99%
“…With the continuous upgrading of electronic devices, their densification and integration trend will inevitably lead to the release of a large amount of heat during work, resulting in local high temperatures and even damaging electronic components [1]. According to research, under certain conditions, the reliability of electronic components will decrease by 5% when the temperature increases by 1 °C [2].…”
Section: Introductionmentioning
confidence: 99%
“…Although the time required for the thermal cycles and the sample preparation was dramatically reduced by implementing both the plasmonic photothermal cycler [28,38] and the direct PCR in the RT-qPCR, the cost per PCR test can still be reduced by innovating the materials and manufacturing techniques. To reduce the cost per PCR close to LFAs, a film of low-cost photothermal material like carbon [39,40] can be manufactured with high throughput manufacturing techniques such as the roll-to-roll (R2R) printing method. [41,42] Therefore, to perform RT-qPCR in the POC device, the assay would be beneficial if it is achieved in a single device within tens of minutes by utilizing lysate without the RNA purification and the photothermal cycler with the inexpensive photothermal heating and cooling method.…”
Section: Introductionmentioning
confidence: 99%
“…With the continuous development of the electrical, electronic, energy and other industries, the demand for interface heat dissipation has become more urgent, and various interface thermal conductivity materials have also attracted the attention of many researchers [1,2]. Mao et al prepared a core-shell structure thermally conductive and insulating thermal interface material composed of Al@Al 2 O 3 and epoxy resin [3].…”
Section: Introductionmentioning
confidence: 99%