Performance Comparison of Silicon Substrates for IC-Waveguide Integration based on a Contactless Transition at mm-Wave frequencies

Aljarosha, Alhassan; Kaul, Piyush; Smolders, A.B.; Matters-Kammerer, Marion K.; Maaskant, Rob

doi:10.1109/apusncursinrsm.2019.8888834

Cited by 1 publication

(1 citation statement)

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“…For these reasons, the exploration of new concepts to realize compact and highly efficient power combiners is essential for efficient high-power systems [11]. In addition, the work [12] presented a comparison of several silicon technologies in terms of substrate electric properties to realize a low-loss contactless transition for IC-WG integration. Therefore, such an integration could be achieved using an IC manufactured on a highor moderate-ohmic substrate employed for high-frequency applications.…”

Section: Introductionmentioning

confidence: 99%

Silicon-Based IC-Waveguide Integration for Compact and High-Efficiency mm-Wave Spatial Power Combiners

Aljarosha

Kaul

Smolders

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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Section: Introductionmentioning

confidence: 99%