2017
DOI: 10.1039/c7ra03899b
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PDMS-based microfluidic devices using commoditized PCBs as masters with no specialized equipment required

Abstract: A simple, convenient and reliable approach used to prepare general polymer PDMS-based microfluidic devices with a minimal requirement for equipment.

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Cited by 14 publications
(11 citation statements)
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References 39 publications
(53 reference statements)
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“…Printed Circuit Board based masters for microfluidic devices is a cost-effective alternative for master fabrication, and it does not require any cleanroom facility 29,30 and hence, most suited to the small research groups who do not have access to the cleanroom facility. The thickness of copper on copper clad laminate decides the height of the microfluidic channel.…”
mentioning
confidence: 99%
“…Printed Circuit Board based masters for microfluidic devices is a cost-effective alternative for master fabrication, and it does not require any cleanroom facility 29,30 and hence, most suited to the small research groups who do not have access to the cleanroom facility. The thickness of copper on copper clad laminate decides the height of the microfluidic channel.…”
mentioning
confidence: 99%
“…The PCB copper also allows pre-release electric stimulations ( e.g ., corona charging or electrospinning) or impedance-based ( e.g ., capacitive) characterizations of PDMS which, as an example, we have used for evaluating the ability to fabricate very thin, but uniform and robust devices even on large areas. Since PCBs are the standard substrates for electronics and can also be used as components or tools for fabricating micro–nanosystems ( e.g ., lab-on-chip or masters for PDMS microfluidic devices), thin PDMS-on-sacrificial-PCB devices may also be easier to be interconnected with electronics and other PCB micro–nanosystems. The reported sacrificial PCB strategy, though extraordinarily simple, can prove useful for important applications, such as epidermal electronics, flexible electronics, triboelectric nanogenerators, tissue engineering, and so on.…”
Section: Discussionmentioning
confidence: 99%
“…The structured PDMS was then bonded with pre-heated PDMS substrates as described previously. 23 The temperature of the PDMS chips was kept above 60 °C until the electrode channels were filled with melted gallium indium alloy (52 °C gallium indium alloy, Abond Mechatronics Corp., Shandong, China). PTFE (polytetrafluoroethylene) tubes (id.…”
Section: Methodsmentioning
confidence: 99%