1991
DOI: 10.1007/bf02651899
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Pd/Zn/Pd/Au ohmic contacts to ρ-Type InP

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Cited by 32 publications
(19 citation statements)
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“…Alternative p-type contacts with better morphology have been reported using several approaches. One such contact involves the use of Pd/Zn/Pd/Au [62]. P d 2 W forms at low temperatures followed by PdZn at 250OC.…”
Section: Contacts To Inpmentioning
confidence: 99%
“…Alternative p-type contacts with better morphology have been reported using several approaches. One such contact involves the use of Pd/Zn/Pd/Au [62]. P d 2 W forms at low temperatures followed by PdZn at 250OC.…”
Section: Contacts To Inpmentioning
confidence: 99%
“…Additionally, many contact recipes developed for bulk semiconductors are based on hightemperature annealing, which leads to compounds forming and local drive-in of dopants which have been added to the metal layers. For example, a Pd/Zn/Pd/Au combination has been used for ohmic contacts to bulk p-type InP [123]. At a temperature of around 400 ⁰C, Pd reacts with InP and the Zn is driven into the InP since the second Pd layer acts as a cap.…”
Section: Electrical Methodsmentioning
confidence: 99%
“…One approach was to use near-noble transition metals such as Pd and Ni whose reactivity with the native oxide are relatively high. [4][5][6][7] Another approach was to control the native oxide: in the case of AuZn contacts, Au and Zn were expected to diffuse into InP easily at lower temperatures and deep protrusions were not expected to be generated if there was no native oxide layer at the AuZn/InP interface. Prior to deposition several kinds of chemical etching to remove the contaminants and the native oxides grown on the InP surface were tried, however similar characteristics of AuZn ͑AuBe͒ contacts were reported.…”
Section: Introductionmentioning
confidence: 99%