PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation

Sarvar, F.; Poole, N. J.; Witting, P. A.

doi:10.1007/bf02662823

Cited by 72 publications

(18 citation statements)

References 1 publication

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“…The substrate was FR4-Epoxy material, which has a relative permittivity of 4.35 at 2.5 GHz with a loss tangent of 0.018 [10]. SMA connectors were installed on PCB filters using standard silver solder, while the microstrip and ground of the 3D printed filters used conductive silver epoxy with a resistivity of ρ = 4 × 10 −6 mΩ/sq [12]. The microstrips were fabricated using DuPont's CB028 silver ink.…”

Section: Filter Design Discussionmentioning

confidence: 99%

“…This silver ink is mainly composed of nano and micro particle flakes that must come into intimate contact after curing in order to conduct. As a result, the resistivity of the silver ink (ρ = 10 mΩ/sq) is considerably higher than pure copper [13]. The relative permittivity of the ABS was measured using a Damaskos split-cavity resonator and VNA to be 2.5 with a loss tangent of 0.005.…”

Section: Filter Design Discussionmentioning

confidence: 99%

“…The ABS dielectric was deposited using nScrypt's nFD TM pump since it produced 120 µm line widths easily using nTips TM (900-4000-002); it had a resolution of 0.1 µm [16]. In addition, there was a need to cure the silver ink with heat at 90 • C using a heat blower [13].…”

Section: Manufacturingmentioning

confidence: 99%

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High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Robles¹,

Bustamante²,

Darshni³

et al. 2019

PIER M

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In this work, two different high-frequency filters were produced, and each was manufactured in two different ways, one using conventional PCB technology and the other using hybrid 3D printing. The hybrid 3D printing technique combined the use of microdispensing of conductive inks and fused filament fabrication (FFF) of thermoplastic substrates. Measurements, properties, and comparisons between these filters are discussed. The goal of the research was to benchmark 3D printing of highfrequency filters to more confidently manufacture sophisticated devices and high-frequency systems by hybrid 3D printing.

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Section: Filter Design Discussionmentioning

confidence: 99%

Section: Filter Design Discussionmentioning

confidence: 99%

See 1 more Smart Citation

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Robles¹,

Bustamante²,

Darshni³

et al. 2019

PIER M

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show abstract

“…In this case, the quadcopter frame is constructed of glass reinforced epoxy laminate (FR4) more commonly used in printed circuit board (PCB) manufacturing. It is a composite material comprised of a flame resistant [17,18] woven fibreglass cloth and an epoxy resin binder. It can be seen that the front half of the quadcopter frame (upper area) has no failure detection system incorporated, whereas the rear half (lower area) has the basic level of failure detection integrated onto the FR4 board (see Figure 4).…”

Section: Mesh Structurementioning

confidence: 99%

Damage Detection and Critical Failure Prevention of Composites

Bowkett¹,

Thanapalan²

2017

Failure Analysis and Prevention

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In this chapter, critical failure prevention mechanism for composite material systems is investigated. This chapter introduces both non-destructive failure detection methods and live structural tests and its applications. The investigation begins by presenting a brief review and analysis of current non-destructive failure detection methods. The work proceeds to investigate novel live structural tests, tomography and applications of the proposed techniques.

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“…A few experimental studies are also available in the literature. Sarvar et al [13] measured the anisotropic thermal conductivity of FR-4/epoxy and glass laminates, and Agarwal et al [14] and Graebner et al [15] conducted experimental studies to determine the board's effective thermal conductivity. Similar to the theoretical work, these experimental studies also focused on homogeneous boards which were too simplistic compared to the complex nonhomogeneous boards encountered in actual electronic applications.…”

Section: Introductionmentioning

confidence: 99%

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Doğruöz¹,

Shankaran

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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A printed circuit board (PCB) consists of multiple layers of dielectric material and current-carrying metal traces and vias. Performing system-level simulations of PCBs with detailed trace and via geometries is very costly, the present approach considers the effects of the trace and via geometry in the physical model by importing Electronic Computer Aided Design (ECAD) data comprising the trace and via layout of the board and determines spatially varying orthotropic conductivity (k x , k y , and k z ) on the PCB based on the ECAD data. In addition, the present approach considers the effects of joule heating in the current-carrying traces by utilizing multiple 2-D sources where the powermap is determined by solving the governing dc electric field equations on the trace. In this paper, the effects of both the trace layer orthotropic thermal conductivity and joule heating are studied on a sample PCB. Comparisons are made with earlier studies and conventional models when possible. It is shown that the location of the hot spots and temperature values differ substantially if different methods are used.

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PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation

Cited by 72 publications

References 1 publication

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Damage Detection and Critical Failure Prevention of Composites

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

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