2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00224
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Pb-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages

Kim Byong Jin1,
Dong Su Ryu2,
HyeongIl Jeon3
et al.
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