The Study of Process Enhancements to Improve Flash Removal Performance for Power Packages

Lee, Wai Wai; Alang Abd Hamid, Hazrul; Ting, Jia Yunn

doi:10.1109/eptc59621.2023.10457694

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457694

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The Study of Process Enhancements to Improve Flash Removal Performance for Power Packages

Wai Wai Lee,

Hazrul Alang Abd Hamid,

Jia Yunn Ting

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The Study of Process Enhancements to Improve Flash Removal Performance for Power Packages

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References 6 publications

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