2008
DOI: 10.1116/1.2825164
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Patterned wafer defect density analysis of step and flash imprint lithography

Abstract: Articles you may be interested inFabrication of wafer-scale nanopatterned sapphire substrate by hybrid nanoimprint lithography J. Vac. Sci. Technol. B 32, 06FG06 (2014); 10.1116/1.4898778 Nanoimprint-lithography patterned epitaxial Fe nanowire arrays with misaligned magnetocrystalline and shape anisotropies

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Cited by 13 publications
(5 citation statements)
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“…The mould may have a shorter life span than optical masks, due to physical pressure against a surface. These problems have been addressed by Chou et al [89,90] and others [91][92][93]. Another feature of nanoimprint molding is the bubble defect.…”
Section: The Future For Nanolithographymentioning
confidence: 96%
“…The mould may have a shorter life span than optical masks, due to physical pressure against a surface. These problems have been addressed by Chou et al [89,90] and others [91][92][93]. Another feature of nanoimprint molding is the bubble defect.…”
Section: The Future For Nanolithographymentioning
confidence: 96%
“…All the aforementioned issues may lead to defects in the imprinted resist [43,44]. Additionally, defects may also come from atmospheric particle contamination.…”
Section: Tools and Industrialization Issuesmentioning
confidence: 99%
“…In addition, employing UV curing nanoimprint green lithography for the mass production of advanced electronic devices faces challenges because the adhesion force between the nanoimprint material and the surface of the master template must be minimized with fluorinated surfactants and the adhesion force between the nanoimprint material and underlayer materials must be maximized to avoid various kinds of nanoimprint material pattern peeling, defects, particles, and contaminants [17][18][19][20][21]. Figure 1 shows the pattern peeling of nanoimprint material and other defects which present a challenge that must be resolved for UV curing nanoimprint lithography.…”
Section: Introductionmentioning
confidence: 99%