Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard

Armiento, Craig; Tabasky, M.; Jagannath, C.; Fitzgerald, T. W.; Shieh, C.L.; Barry, V.; Rothman, M.; Negri, A.; Haugsjaa, Paul O.; Lockwood, H. F.

doi:10.1049/el:19910689

Cited by 104 publications

(8 citation statements)

References 1 publication

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“…The feasibility of using microreplication technology in a microelectromechanical system (MEMS) was demonstrated by fabricating a prototype polymeric motherboard for an optical receiver module. Similar motherboard designs have been realized in silicon [5][6][7].…”

Section: Demonstration Of An Optical Receivermentioning

confidence: 95%

Polymeric MST - high precision at low cost

Elderstig¹,

Larsson²

1997

J. Micromech. Microeng.

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A low-cost production process for fabrication of polymeric microstructures from micromachined silicon is demonstrated in a splice for the splicing of optical fibers and an optical motherboard. Measurements on splices showed less than 0.5 dB insertion losses. The prototype polymeric motherboard concisted of an optical receiver module. The detector that was mounted on the polymeric optical motherboard detected about 70% of the transferred light. Measurements with modulated light indicates an optical bandwidth of 5 GHz at 2 V reverse current on the pin-diode.

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Section: Demonstration Of An Optical Receivermentioning

confidence: 95%

Polymeric MST - high precision at low cost

Elderstig¹,

Larsson²

1997

J. Micromech. Microeng.

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“…There have been many reports of passive alignment technologies for optical waveguide devices including the mechanical alignment method, [16][17][18][19][20][21][22][23][24] index alignment method, [25][26][27] and solder bump self-alignment method. 28) They mainly focused on the connections between the optical waveguide chip and fibers; in other words, the multi-chip integration of many optical waveguide chips with a pluggable connection was beyond the scope of these studies.…”

Section: Introductionmentioning

confidence: 99%

Pluggable photonic circuit platform for single-mode waveguide connections using novel passive alignment method

Shikama

Ishikawa

Suzuki

et al. 2018

Jpn. J. Appl. Phys.

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We describe a novel photonic circuit platform and a method for its passive alignment that will allow pluggable and large-scale multi-chip integration for highly functional single-mode waveguides based on planar lightwave circuit (PLC) chips. We achieve our proposed passive alignment method by employing precise mechanical interdigitation between optical fiber based spacers and dry etched rectangular grooves in silica-based PLCs. The method was applied to a PLC-PLC connection device in which two daughter PLC chips were mounted on a mother PLC chip. The assembled device successfully yielded a low connection loss of less than 0.4 dB for all 16 ports with an extremely simple assembly process. We also determined the alignment accuracy of our method by measuring and calculating the connection losses of an assembled Vernier pitch device. The estimated results show that our passive alignment method efficiently provides high alignment accuracy with submicron accuracy.

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“…The cost-effective monolithic integration of photonic systems still faces extensive challenges [3]. Hybrid integration of InGaAsP/InP sources and silica fibers using passive alignment silicon waferboard is suggested and demonstrated for producing optical communication modules [4], [5]. Research work has led to the demonstration and utilization of planar lightwave circuits (PLCs) [6]- [8].…”

mentioning

confidence: 99%

“…The silicon micromachining technologies that are used in the microelectronics industry are widely applied to tool silicon precision substrates for passive alignment fiber optic subassemblies. The accuracy of silicon substrates is adequate for the passive alignment of single mode photonic devices and components [4], [15], [16]. Another possible technology for producing high-precision structures with high aspect ratios and great structural heights with tight tolerances is lithography, electroplating, and molding (LIGA) [17].…”

mentioning

confidence: 99%

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

Keränen

Mäkinen

Kautio

et al. 2006

IEEE Trans. Adv. Packag.

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A concept that utilizes structured planar substrates based on low-temperature cofired ceramics (LTCC) as a precision platform for a miniature passive alignment multimode laser module is demonstrated. The three-dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves, and cavities for the laser-to-fiber coupling. The achieved passive alignment accuracy allows high coupling efficiency realizations of multimode fiber pigtailed laser modules. Thick-film printing and via punching can be incorporated in order to integrate electronic assemblies directly on the optomechanical platform. The platform is scalable, and it allows embedding of subsystems, such as silicon optical bench (SiOB), but it also provides the interface for larger optical systems. Temperature management of high-power laser diodes is achieved by realizing heat dissipation structures and a cooling channel into the LTCC substrate. The measured maximum laser metallization temperature was 70 C when a thermal power of 0.5 W was applied at the laser active area using a liquid cooling of 50 mL/min. The measured maximum temperature of the laser surface was about three times higher without liquid cooling. Optical coupling efficiency of the multimode laser systems was simulated using optical systems simulation software. The nominal coupling efficiency between 100 1 m stripe laser and 62.5/125-m graded index fiber (NA = 0.275) was 0.37. The simulated coupling efficiency and alignment tolerances were verified by prototype realization and characterization. The measured alignment tolerance values between laser and fiber in AT prototype series were 1 = 7.7 m, 1 = 7.6 m, and 1 = 10.8 m (SD values). The corresponding values in A2 prototype series were 1 = 3.1 m, 1 = 9.1 m, and 1 = 10.2 m. The measured average coupling efficiency was 0.28 in AT series and 0.31 in A2 series. The coupling efficiencies of all operational prototypes varied from 0.05 to 0.43.

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Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard

Cited by 104 publications

References 1 publication

Polymeric MST - high precision at low cost

Polymeric MST - high precision at low cost

Pluggable photonic circuit platform for single-mode waveguide connections using novel passive alignment method

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

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