2013
DOI: 10.1016/j.egypro.2013.07.357
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Passivation of Optically Black Silicon by Atomic Layer Deposited Al2O3

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Cited by 14 publications
(12 citation statements)
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“…These surface and sub‐surface defects, together with an altered thickness of the passivating layer, explain the significant loss in minority‐carrier lifetime observed for dry‐plasma‐etched nanopatterned silicon wafers. A more conformal passivating layer such as aluminum oxide deposited by atomic layer deposition (ALD) would possibly result in better performance . However, for thin‐film technologies on foreign substrates , where the heterojunction emitter is on the nanopattern side and a transparent conducting oxide is needed, such a passivating layer is not an option.…”
Section: Resultsmentioning
confidence: 99%
“…These surface and sub‐surface defects, together with an altered thickness of the passivating layer, explain the significant loss in minority‐carrier lifetime observed for dry‐plasma‐etched nanopatterned silicon wafers. A more conformal passivating layer such as aluminum oxide deposited by atomic layer deposition (ALD) would possibly result in better performance . However, for thin‐film technologies on foreign substrates , where the heterojunction emitter is on the nanopattern side and a transparent conducting oxide is needed, such a passivating layer is not an option.…”
Section: Resultsmentioning
confidence: 99%
“…Published by AIP Publishing. 122, 143101-1 von Gastrow et al 10 The importance of low sub surface plasma damage was also highlighted by Otto et al 11 In order to optimize the RIE process, we consider black Si formation consisting of three steps (even though it is a single SF 6 /O 2 plasma process): 17 (1) isotropic Si etching with fluorine radicals to form volatile SiF 4 ; (2) addition of O 2 causes a local masking layer of SiF x O y to build on the Si surface (mainly on sidewalls); and (3) etching of the SiOF passivation and Si layers. The etching process includes chemical and physical etching (ion-assisted etching).…”
Section: And A)mentioning
confidence: 96%
“…Fabrication of black Si using RIE can be achieved at cryogenic 10 as well as non-cryogenic conditions. 11,12 The cryogenic RIE process may lead to very low surface damage resulting in high effective carrier lifetime; the process is however difficult or costly to industrialize, and for that reason the non-cryogenic RIE process is preferred. In the non-cryogenic RIE process, surface damage due to energetic ion-bombardment causes a reduction of the effective carrier lifetime due to surface or near surface recombination.…”
Section: Introductionmentioning
confidence: 99%
“…In their work, aluminium oxide formed by atomic layer deposition (ALD) was used to circumvent the surface recombination issue in black silicon. Several recent studies have shown that ALD is the most suitable technique to fully cover and passivate nanostructured surfaces [21,22].…”
Section: Introductionmentioning
confidence: 99%